Wi-Fi Chipset Market Size was valued at USD 22.5 billion in 2021. The Wi-Fi chipset market industry is projected to grow from USD 23.85 Billion in 2022 to USD 35.91 billion by 2030, exhibiting a compound annual growth rate (CAGR) of 6.02% during the forecast period (2022 - 2030). The rapidly increasing need for improved network bandwidth, low latency communication systems across enterprises, and increased investments in developing next-generation smartphones are key factors driving the Wi-Fi chipset market growth.
Source: Secondary Research, Primary Research, MRFR Database, and Analyst Review
The widespread global adoption of the IoT (Internet of Things) in the residential, industrial, and commercial sectors has created a demand for advanced automation, driving demand for wireless chipsets. Automation integration across applications offers improved productivity, adaptability, dependability, high security, increased output, faster processing, more convenient living, and cost-effectiveness. Nevertheless, more Internet of Things connections in various industries is anticipated to propel the wireless chipset market's expansion in the following years. For instance, the European Telecommunications Network Operators' Association (ETNO) reports that there is currently about 16 million Internet of Things connections built into smart buildings across Europe, with the number expected to reach 154 million by the end of 2025.
Furthermore, rising criminal activity, combined with increased government efforts and plans to encourage the setup of advanced real-time surveillance technologies to provide enhanced security, is anticipated to affect wireless chipset market revenue growth. In light of this, automation is likely to increase demand for wireless chipsets on a global scale.
Based on the type, the Wi-Fi Chipset Market segmentation includes Wi-Fi and industrial Wi-Fi. The industrial Wi-Fi segment held the majority share in 2021, accounting for approximately 46–49% of the Wi-Fi Chipset Market revenue. The substantial growth is attributed to the rising demand for high-performance network connectivity, which allows multiple users to access simultaneously at constant bandwidth capacity. Given this context, businesses are utilizing next-generation industrial Wi-Fi chipsets to introduce new capabilities and functionalities to meet their expanding demand. Broadcom, for example, announced the availability of new chipset solutions for the Wi-Fi 7 ecosystem. These services will enhance the user experience by providing low latency, dependable communication, and increased range. Additionally, the adoption of Wi-Fi chipsets is anticipated to rise with the addition of 320 MHz, which doubles the industrial Wi-Fi channel bandwidth, ultimately promoting the expansion of the wireless chipset market.
Source: Secondary Research, Primary Research, MRFR Database, and Analyst Review
Based on fabrication technology, the Wi-Fi Chipset Market segment includes FinFET, Fdsoi Cmos, silicon-on-insulator (SOI), and Sige. Silicon on Insulator (SOI) dominated the global market in 2021 and is expected to be the fastest-growing segment in the forecast period of 2022-2030. Silicon on Insulator (SOI) has highly integrated plug-and-play capabilities. It is a small-form-factor embedded wireless subsystem that includes a Wireless LAN (WLAN) stack, TCP/IP stack, and supplicant. Numerous benefits, including increased capacity, improved data rates, and power efficiency, are credited with segment growth. These advantages persuade consumer electronics manufacturers to integrate Wi-Fi chipsets into their line of tablets, smartphones, and wearable tech. Organizations are concentrating on increasing wireless communication bandwidth and data transfer rate owing to ongoing IoT fabrication technology advancements.
Based on the die size, the Wi-Fi Chipset Market segmentation includes 28nm, 20nm, 14nm, and 10nm. The 20nm die size segment had the highest market revenue share in 2021 owing to the standard size utilized among global chipset manufacturers. These frames boost network performance while decreasing network interference from other networks. As a result, it is expected to see a tremendous increase in commercial, residential, and industrial applications. The adoption of next-generation WLAN infrastructure is also predicted to rise due to a strong emphasis on delivering superior client services and experiences by bolstering network bandwidth capacity. The demand for 14nm die-size chipsets for these WLAN devices is thus likely to rise.
Based on the application, the Wi-Fi Chipset Market segment includes smartphones, tablets, and PCs. In 2021, the smartphone application segment had the highest market revenue share. Rising 5G deployment initiatives in many countries worldwide are one factor driving the smartphone Wi-Fi chipsets market. With the help of chipsets, smartphone manufacturers have integrated 5G compatibility to support the 5G network. Wi-Fi chipsets are being integrated into smartphones and other wireless communication systems. It has attributed much more to the growth of the IT sector and advancements in wireless connectivity, device combinations, and access point equipment. Smartphones have grown in popularity since they were introduced as a replacement for tablets in the digital market.
By Region, the study provides market insights into Europe, North America, Asia-Pacific, and the Rest of the World. The North American Wi-Fi chipset market is expected to grow at a significant CAGR during the study period, accounting for USD 9.87 billion in 2021, owing to widespread regional Internet of Things adoption (IoT). The increasing use of high-tech smart devices and consumer electronics and the growing use of wireless chipsets encourages further investment in the wireless chipset space. Further fueling the demand for Wi-Fi chipsets in the region is the trend toward industrial automation. The region's reliance on wireless technology is also growing to provide favorable infrastructure to technology companies and other industries and guarantee a stable network across commercial and residential sectors. Furthermore, large wireless companies have a strong presence in North America, making it an important regional market for Wi-Fi chipset technology.
Moreover, the major countries covered in the market report include the United States, Germany, Canada, France, the United Kingdom, Italy, Spain, India, Japan, Australia, China, South Korea, and Brazil.
Source: Secondary Research, Primary Research, MRFR Database, and Analyst Review
The European Wi-Fi chipset market is the world's second-largest owing to the growing demand for open-source software and the region's increased prevalence of data security. Smartphone adoption in the United Kingdom and Germany is expected to drive regional Wi-Fi semiconductor chipset market share during the assessment period. This expansion can be attributed to lower prices and advancements in smartphone technology. Additionally, the high consumption of Wi-Fi chipsets by businesses & enterprises, automotive companies, and smart devices, combined with the rising demand for Wi-Fi chipsets by IEEE standards, are driving the smartphone Wi-Fi chipset in Europe. Further, the U.K. Wi-Fi chipset market held the largest market share, and the German Wi-Fi chipset market was the fastest-growing market in the European region.
The Asia Pacific Wi-Fi chipset market is expected to grow at the fastest CAGR during the forecast period, owing to the presence of many Wi-Fi chipset manufacturing companies and the use of Wi-Fi chipsets in finished products. In addition, it is anticipated that increased government adoption of public hotspots in developing nations like Japan, South Korea, China, Singapore, and India will drive the Wi-Fi device market demand during the forecasting years. As a result, China accounted for most of the Asia Pacific wireless chipset market. By IEEE standards, China will be the top country producing Wi-Fi chipsets in 2023. In addition, the Asia-Pacific region's expanding adoption of wi-fi technology in education, healthcare, retail, and other sectors has significantly contributed to the market's expansion.
Key Wi-Fi chipset manufacturers strategically collaborate with end-use clients such as smartphone manufacturers to supply Wi-Fi 6e chipsets. Major players focus on product launches, collaborations, partnerships, and R&D activities to stay competitive and gain market share. Key wireless chipset industry players invest in product innovation to meet the changing demands of the Wi-Fi devices sector.
Broadcom Inc is an American semiconductor and infrastructure software product designer, developer, and manufacturer. Broadcom's products are used in data centers, networking, software, broadband, wireless, storage, and industrial applications. In January 2021, Broadcom Inc. and Apple Inc. entered into a partnership and agreement. The strategic alliance aimed to provide Broadcom Inc's wi-fi 6e chipsets to Apple Inc.'s smartphones, laptops, and iPads. The supply agreement for the chipset is worth USD 15 billion. In addition to Apple Inc, Broadcom Inc also supplies the wi-fi s chipsets for Samsung devices, such as the Galaxy 10 and Galaxy Note 10. Broadcom Inc. has given Samsung over 150 million wi-fi 6e chipsets until February 2021.
Marvell Technology Inc is an American company based in Santa Clara, California, that develops and manufactures semiconductors and related technology. In May 2021, NXP Semiconductors paid $ 1.76 billion for Marvell's wireless connection business. The strategic acquisition includes Marvell's Bluetooth and Wi-Fi (including wi-fi 6e) technology portfolios and related assets. Additionally, the acquisition will give NXP access to a wider range of wi-fi s chipsets for important application areas like industrial automation, IoT, and automotive.
Qualcomm Technologies Inc (US)
Mediatek Inc (Taiwan)
Intel Corporation (US)
STMicroelectronics NV (Switzerland)
Cypress Semiconductor Corporation (US)
Taiwan Semiconductor Manufacturing Co. Ltd (Taiwan)
Global Foundries (US)
Broadcom Inc (US)
Marvell Technology Group Ltd (Bermuda)
Quantenna Communications Inc (US)
Peraso Technologies Inc (Canada)
Texas Instruments Inc (US)
Samsung Electronics Co Ltd (South Korea)
United Microelectronics Corporation (Taiwan)
Broadcom Inc. announced the availability of samples of its entire end-to-end Wi-Fi 7 chipset solutions, for instance, Wi-Fi routers, residential gateways, enterprise access points and client devices, in April 2022. More than twice the speed of current Wi-Fi 6 and 6E solutions, these chips also provide low-latency connections as well as increased range. Broadcom’s Wi-Fi 7 ecosystem products include BCM67263, BCM6726, BCM43740, BCM43720 and BCM4398.
For Example, in March 2022, Broadcom Corporation, which provides industry-leading Wi-Fi chips for both client devices and network infrastructure, revealed it had shipped one billion Wi-fi 6/6e chips (and that is not all). It also means that just within a year; the company has distributed half a billion wi-fi 6/6e chips. This information basically suggests that Wi-Fi will be available in the market in the coming months.
Qualcomm’s latest chip already supports Wifi-7 since February 2022. The technology edge of Wifi-7 includes High Band Simultaneous (HBS) Multi-Link, which can use two distinct radios to achieve four connection streams at those high-spectrum ranges such as top theorize (though let’s not forget about Wifi-6 Release 2 first built on wifi-6 and wifi-6e) or doubles potential maximum channel width up to 320Mhz at the 6Ghz range introduced with WiFi-6E.
In August 2021, SecurePass was launched by GoZone WiFi, which is US US-based niche provider of turn-key secure multi-device management solutions for seamless guest access across a wide range of facility types. Immediate prime verticals and use cases for this solution are outdoor recreational places like campgrounds, RV parks, marinas or state/national parks; MDU’s smart buildings; conference facilities; and campus communities etc. There will be such trends in the market that will create an opportunity for its players to grow.
Wi-Fi
Industrial Wi-Fi
FinFET
Fdsoi Cmos
Silicon on Insulator (SOI)
Sige
28nm
20nm
14nm
10nm
Smartphone
Tablets
PC
North America
US
Canada
Europe
Germany
France
UK
Italy
Spain
Rest of Europe
Asia-Pacific
China
Japan
India
Australia
South Korea
Australia
Rest of Asia-Pacific
Rest of the World
Middle East
Africa
Latin America
| Report Attribute/Metric | Details |
| Market Size 2021 | USD 22.5 Billion |
| Market Size 2022 | USD 23.85 Billion |
| Market Size 2030 | USD 35.91 Billion |
| Compound Annual Growth Rate (CAGR) | 6.02% (2022-2030) |
| Base Year | 2021 |
| Market Forecast Period | 2022-2030 |
| Historical Data | 2018 & 2020 |
| Market Forecast Units | Value (USD Billion) |
| Report Coverage | Market Competitive Landscape, Revenue Forecast, Growth Factors, and Trends |
| Segments Covered | Type, Fabrication Technology, Die Size, Application, and Region |
| Geographies Covered | Europe, North America, Asia Pacific, and the Rest of the World |
| Countries Covered | The U.S, Germany, Canada, the UK, France, Italy, Spain, India, Japan, Australia, China, South Korea, and Brazil |
| Key Companies Profiled | Mediatek Inc (Taiwan), Qualcomm Technologies Inc (US), STMicroelectronics NV (Switzerland), Intel Corporation (US), Cypress Semiconductor Corporation (US), Global Foundries (US), Broadcom Inc (US), Taiwan Semiconductor Manufacturing Co. Ltd (Taiwan), Quantenna Communications Inc (US), Marvell Technology Group Ltd (Bermuda), Peraso Technologies Inc (Canada), Samsung Electronics Co Ltd (South Korea), Texas Instruments Inc (US), United Microelectronics Corporation (Taiwan) |
| Key Market Opportunities | Emerging public wi-fi hotspots in developing nations |
| Key Market Dynamics | An increasing global trend toward smart home devices Rising demand for Wi-Fi devices in business and enterprises |
Wi Fi Chipset Market Highlights:
Frequently Asked Questions (FAQ) :
The Wi-Fi Chipset Market size was valued at USD 22.5 Billion in 2021.
The global market is projected to grow at a CAGR of 6.02% during the forecast period, 2022-2030.
In 2021, North America had the largest revenue share of the global market.
The key players in the market are Mediatek Inc (Taiwan), Qualcomm Technologies Inc (US), STMicroelectronics NV (Switzerland), Intel Corporation (US), Cypress Semiconductor Corporation (US), Global Foundries (US), Broadcom Inc (US), Taiwan Semiconductor Manufacturing Co. Ltd (Taiwan), Quantenna Communications Inc (US), Marvell Technology Group Ltd (Bermuda), Peraso Technologies Inc (Canada), Samsung Electronics Co Ltd (South Korea), Texas Instruments Inc (US), and United Microelectronics Corporation (Taiwan).
The Silicon on Insulator (SOI) category dominated the global market in 2021.
In 2021, smartphones had the largest global market share.
Team Lead - Research she holds an experience of about 6+ years in market research and business consulting, working under the spectrum of information communication technology, telecommunications and semiconductor domains. aarti conceptualizes and implements a scalable business strategy and provides strategic leadership to the clients. her expertise lies in market estimation, competitive intelligence, pipeline analysis, customer assessment, etc.
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