US Wafer Level Packaging Market

Driven by technological progress, miniaturization trends and growing use of advanced packaging in the semiconductor industry, demand for wafer-level packing (WLP) is rampaging in the United States.
Because of increasing demands for electronic devices with higher functionality and including advanced sensors, MEMS (Micro-Electro Mechanical Systems) and RF (Radio Frequency) components, WLP is seeing wider use. This packaging procedure facilitates the combination of various functions on a single chip, greatly expanding the capabilities of electronic devices.
It becomes more necessary to apply WLP with the spread of 5G technology and the growing complexity in wireless communication systems. The packaging technology also helps integrate the RF components and high-frequency elements needed to build 5G infrastructure and devices.
WLP provides higher electrical performance and reliability than conventional packaging techniques. These shorter interconnects, reduced parasitics and improved thermal management all contribute to the overall performance and reliability of semiconductor devices -- especially in high-performance computing applications as well as automotive ones.
With automotive electronics getting more and more sophisticated, including Advanced Driver Assistance Systems (ADAS), high-tech packaging solutions are in demand. WLP solves the space limitations and thermal issues in automotive applications, satisfying market requirements for intelligent connected cars.
Medical devices that require a high standard of size, weight and reliability have led to growing adoption in WLP. The packaging technology has catalyzed the development of compact and mobile medical devices, from wearable health monitors to implantable medicine electronics.
With the rise of AR and VR technologies, advanced semiconductor packaging solutions are required. Packaging for high-performance graphics processors and sensors is a problem, but WLP can help unlock immersion in augmented reality (AR) and virtual reality (VR) applications. The emergence of flexible display technologies in smartphones and other electronic devices is driving the demand for WLP. This packaging method is conducive to integrating components on flexible substrates, providing the possibility of stellar display form factors.