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    US Chip Packaging Market

    ID: MRFR/SEM/17631-HCR
    200 Pages
    Garvit Vyas
    September 2025

    US Chip Packaging Market Research Report By Type (Fan-Out Wafer-Level Packaging, Fan-In Wafer-Level Packaging, Flip Chip, 5D/3D) and By Application (Telecommunications, Automotive, Aerospace and Defense, Medical Devices, Consumer Electronics) - Forecast to 2035

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    US Chip Packaging Market Research Report -Forecast till 2035 Infographic
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    Table of Contents

    US Chip Packaging Market Summary

    The US Chip Packaging market is projected to grow significantly from 14.5 USD Billion in 2024 to 36 USD Billion by 2035.

    Key Market Trends & Highlights

    US Chip Packaging Key Trends and Highlights

    • The US Chip Packaging market is valued at 14.5 USD Billion in 2024.
    • By 2035, the market is expected to reach 36 USD Billion, indicating robust growth.
    • The compound annual growth rate (CAGR) for the period from 2025 to 2035 is estimated at 8.62%.
    • Growing adoption of advanced packaging technologies due to increasing demand for high-performance electronics is a major market driver.

    Market Size & Forecast

    2024 Market Size 14.5 (USD Billion)
    2035 Market Size 36 (USD Billion)
    CAGR (2025-2035) 8.62%

    Major Players

    TSMC, Infineon Technologies, ASE Group, Micron Technology, Maxim Integrated, Qualcomm, Amkor Technology, Intel, Broadcom, Rohm Semiconductor, Analog Devices, Texas Instruments, STMicroelectronics, ON Semiconductor, NXP Semiconductors

    US Chip Packaging Market Trends

    The US Chip Packaging Market is witnessing significant growth driven by increasing demand for advanced semiconductor technologies and the miniaturization of electronic devices. As companies aim to improve performance while reducing size and weight, there is a rising focus on advanced packaging techniques like 3D packaging and system-in-package (SiP) solutions. These innovations allow for better thermal management, reduced power consumption, and enhanced functionality, aligning with the needs of industries such as consumer electronics, automotive, and communications. There is also a notable trend toward sustainable packaging solutions, as the US government and various organizations push for environmentally friendly practices.

    The adoption of recyclable materials and processes that minimize waste are gaining traction, which not only meets regulatory requirements but also appeals to environmentally conscious consumers. Opportunities in the US Chip Packaging Market are abundant, particularly in sectors like electric vehicles and smart devices, where the demand for chips with advanced packaging technology is expected to surge. Investments in domestic manufacturing capabilities are encouraged, especially as the US seeks to reduce its reliance on foreign semiconductor supplies, further propelling local chip packaging innovations.

    Furthermore, the recent macroeconomic climate has led to a reshuffling in supply chain strategies, emphasizing localization and resilience. Companies are exploring partnerships and collaborations to leverage technological advancements and enhance their competitive edge in chip packaging. This trend reflects a broader shift towards adaptability, as firms navigate the complexities of global and domestic market dynamics, ensuring they remain responsive to evolving consumer and industrial needs.

    US Chip Packaging Market Drivers

    Market Segment Insights

    Chip Packaging Market Type Insights

    The US Chip Packaging Market, categorized into various types, is witnessing significant dynamics due to the advancing technologies and ever-changing consumer demands. Among these types, Fan-Out Wafer-Level Packaging is gaining notable traction, primarily attributed to its ability to provide high-density interconnections and compact designs, which are crucial for modern electronic devices. Fan-In Wafer-Level Packaging, while not as widely adopted as its counterpart, serves as a vital solution for applications requiring less complex packaging but still demanding efficient space utilization.

    Flip Chip technology plays a significant role as well, especially in high-performance applications, as it facilitates direct chip connections to the substrate, enhancing electrical performance and reducing signal noise. Furthermore, the advent of 5D/3D packaging technologies is creating opportunities for complex integration and multidimensional layout designs, enabling developers to maximize functionality in limited spaces. These various types collectively contribute to the evolving landscape of the US Chip Packaging Market, providing essential features that cater to a wide array of industries such as consumer electronics, telecommunications, and automotive sectors.

    As the demand for smaller, faster, and more efficient components grows, the packaging strategies employed in the chip manufacturing process will remain pivotal in driving innovation within these segments, illustrating the market's trend towards enhanced miniaturization and performance optimization. The advancements in materials and processes are also set to influence the competitive landscape, indicating that continued investment in Research and Development will be critical for stakeholders to maintain a competitive edge in the US Chip Packaging Market.

    Additionally, the increasing emphasis on speed, reliability, and thermal performance further underscores the necessity for specialized packaging approaches that are tailored to meet the specific needs of various applications. With semiconductor fabrication continuously evolving, the importance of robust packaging solutions in ensuring longevity and operational efficacy of chips becomes increasingly paramount, hinting at a sustained growth trajectory within this market segment. As technology progresses and demands shift, stakeholders in the US Chip Packaging Market will likely focus on innovative solutions that not only streamline production but also enhance the performance and durability of electronic devices across multiple sectors.

    Source: Primary Research, Secondary Research, MRFR Database and Analyst Review

    Chip Packaging Market Application Insights

    The Application segment of the US Chip Packaging Market plays a pivotal role in determining the growth dynamics and overall trajectory of the industry. The telecommunications sector is crucial as it drives demand for advanced semiconductor packaging solutions that support next-generation networks and wireless communications. In the automotive sector, the shift towards electric vehicles and smart technology results in escalating needs for highly reliable and efficient chip packaging to ensure vehicle safety and performance.

    The Aerospace and Defense industry demands cutting-edge packaging technologies to withstand extreme conditions while maintaining operational functionality.Medical devices increasingly rely on innovative chip packaging to improve diagnostics and patient care, reflecting the rising importance of health technology. Additionally, the consumer electronics sector significantly contributes to market growth, fueled by the constant demand for smaller, faster, and more energy-efficient devices.

    This diverse Application segmentation in the US Chip Packaging Market is shaped by technological advancement and evolving industry needs, highlighting the industry's capacity to adapt to market changes while addressing specific requirements across various applications.As the landscape evolves, it opens up numerous opportunities for growth and innovation within each of these segments, aligning with the overarching market trends.

    Get more detailed insights about US Chip Packaging Market Research Report -Forecast till 2035

    Regional Insights

    Key Players and Competitive Insights

    The US Chip Packaging Market has become a focal point for various companies looking to establish or enhance their foothold within the semiconductor industry. As technology progresses, the demand for efficient and innovative chip packaging solutions continues to surge, leading to increased competition among key players. This competitive landscape is characterized by rapid technological advancements, evolving customer requirements, and an emphasis on sustainability and cost efficiency. Companies are not only striving to develop advanced packaging techniques that improve performance and reliability but are also investing heavily in research and development to stay ahead of the competition.

    With new entrants emerging and established firms bolstering their capabilities, the market is poised for a transformative period, driving players to differentiate themselves based on innovation, quality, and service. TSMC, as a leading foundry, holds a significant position in the US Chip Packaging Market, demonstrating substantial strengths that bolster its competitive edge. The company's extensive experience in advanced semiconductor processes allows it to deliver high-quality packaging solutions that meet the rigorous demands of various industries. TSMC's unparalleled technological expertise enables it to provide innovative packaging options that significantly enhance performance while maintaining cost-effectiveness.

    Furthermore, the company has established strong partnerships with major technology firms, providing collaborative platforms for joint development and innovation. Combining its robust capacity with a focus on customer-centric solutions, TSMC effectively meets the growing demands for complex chip architecture, ensuring its prominent position within the US market. Infineon Technologies, another formidable player in the US Chip Packaging Market, offers a diverse range of products and services, including automotive microcontrollers, power semiconductors, and sensors. The company’s strong presence in the US is bolstered by its commitment to quality, reliability, and cutting-edge technology that consistently aligns with market demands.

    Infineon's strengths lie in its significant investments in research and development, aimed at creating innovative packaging solutions that cater to emerging technologies, such as electric vehicles and renewable energy. Over recent years, Infineon has strategically pursued various mergers and acquisitions to enhance its market profile, integrating complementary technologies and capabilities that further solidify its position. These strategic moves not only augment its product portfolio but also enable Infineon to address the increasing complexity of chip packaging in the US semiconductor landscape.

    Key Companies in the US Chip Packaging Market market include

    Industry Developments

    Recent developments in the US Chip Packaging Market are significant as companies like Intel and Qualcomm are ramping up production capabilities to support the growing demand for semiconductor devices. In August 2023, Micron Technology announced a $15 billion investment in expanding its manufacturing capabilities in the US, which is expected to bolster local production and create thousands of jobs. Furthermore, in September 2023, TSMC revealed plans to construct a new chip fabrication facility in Arizona, aiming to enhance its packaging and assembly services on US soil.

    Merger and acquisition activity in the sector has been noteworthy, particularly in 2022 when Infineon Technologies acquired Cypress Semiconductor for $9 billion, enhancing its product portfolio. Similarly, in May 2023, Amkor Technology announced its acquisition of a packaging technology firm to diversify its offerings. The overall valuations of companies in this market have experienced considerable growth, influenced by increasing consumer demand and government initiatives to support semiconductor manufacturing in the US.

    Significant policy measures, including the CHIPS Act, have also been enacted to incentivize investment in domestic semiconductor production, with intent to reduce dependency on international supply chains, which directly benefits firms like Texas Instruments and Broadcom.

    Market Segmentation

    Outlook

    • Telecommunications
    • Automotive
    • Aerospace and Defense
    • Medical Devices
    • Consumer Electronics

    Chip Packaging Market Type Outlook

    • Fan-Out Wafer-Level Packaging
    • Fan-In Wafer-Level Packaging
    • Flip Chip
    • 5D/3D

    Chip Packaging Market Application Outlook

    • Telecommunications
    • Automotive
    • Aerospace and Defense
    • Medical Devices
    • Consumer Electronics

    Report Scope

    Report Attribute/Metric Source: Details
    MARKET SIZE 2018 12.86 (USD Billion)
    MARKET SIZE 2024 14.5 (USD Billion)
    MARKET SIZE 2035 36.0 (USD Billion)
    COMPOUND ANNUAL GROWTH RATE (CAGR) 8.618% (2025 - 2035)
    REPORT COVERAGE Revenue Forecast, Competitive Landscape, Growth Factors, and Trends
    BASE YEAR 2024
    MARKET FORECAST PERIOD 2025 - 2035
    HISTORICAL DATA 2019 - 2024
    MARKET FORECAST UNITS USD Billion
    KEY COMPANIES PROFILED TSMC, Infineon Technologies, ASE Group, Micron Technology, Maxim Integrated, Qualcomm, Amkor Technology, Intel, Broadcom, Rohm Semiconductor, Analog Devices, Texas Instruments, STMicroelectronics, ON Semiconductor, NXP Semiconductors
    SEGMENTS COVERED Type, Application
    KEY MARKET OPPORTUNITIES Increased demand for miniaturization, Growth in 5G technology applications, Expanding electric vehicle market, Innovations in eco-friendly materials, Rising trend of advanced packaging technologies
    KEY MARKET DYNAMICS Technological advancements, Growing demand for miniaturization, Sustainability concerns, Increasing integration of IoT, Rising focus on packaging efficiency
    COUNTRIES COVERED US

    Market Highlights

    Author
    Garvit Vyas
    Analyst

    Explore the profile of Garvit Vyas, one of our esteemed authors at Market Research Future, and access their expert research contributions in the field of market research and industry analysis

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    FAQs

    What is the expected market size of the US Chip Packaging Market in 2024?

    The US Chip Packaging Market is expected to be valued at 14.5 billion USD in 2024.

    What is the projected market size of the US Chip Packaging Market by 2035?

    By 2035, the US Chip Packaging Market is expected to reach a valuation of 36.0 billion USD.

    What is the expected CAGR for the US Chip Packaging Market from 2025 to 2035?

    The market is expected to grow at a CAGR of 8.618 percent from 2025 to 2035.

    Which type of chip packaging is expected to dominate the market in terms of value in 2024?

    Fan-Out Wafer-Level Packaging is projected to have a market value of 5.0 billion USD in 2024.

    What will the market value of Fan-In Wafer-Level Packaging be in 2035?

    The market value for Fan-In Wafer-Level Packaging is expected to reach 8.0 billion USD by 2035.

    Who are the key players in the US Chip Packaging Market?

    Major players in the market include TSMC, Infineon Technologies, ASE Group, and Micron Technology.

    What is the expected market size of the Flip Chip segment in 2024?

    The Flip Chip segment is projected to be valued at 4.0 billion USD in 2024.

    How much is the 5D/3D segment expected to grow by 2035?

    The 5D/3D segment is anticipated to grow to a market value of 6.5 billion USD by 2035.

    What are the key growth drivers for the US Chip Packaging Market?

    Key growth drivers include the increasing demand for advanced packaging technologies and the rising adoption of semiconductor devices.

    How are current global conflicts impacting the US Chip Packaging Market?

    Current global conflicts are likely to create challenges in supply chains and material availability impacting market dynamics.

    1. EXECUTIVE SUMMARY
    2. Market Overview
    3. Key Findings
    4. Market Segmentation
    5. Competitive Landscape
    6. Challenges and Opportunities
    7. Future Outlook
    8. MARKET INTRODUCTION
    9. Definition
    10. Scope of the study
    11. Research Objective
    12. Assumption
    13. Limitations
    14. RESEARCH METHODOLOGY
    15. Overview
    16. Data Mining
    17. Secondary Research
    18. Primary Research
    19. Primary Interviews and Information Gathering Process
    20. Breakdown of Primary Respondents
    21. Forecasting Model
    22. Market Size Estimation
    23. Bottom-Up Approach
    24. Top-Down Approach
    25. Data Triangulation
    26. Validation
    27. MARKET DYNAMICS
    28. Overview
    29. Drivers
    30. Restraints
    31. Opportunities
    32. MARKET FACTOR ANALYSIS
    33. Value chain Analysis
    34. Porter's Five Forces Analysis
    35. Bargaining Power of Suppliers
    36. Bargaining Power of Buyers
    37. Threat of New Entrants
    38. Threat of Substitutes
    39. Intensity of Rivalry
    40. COVID-19 Impact Analysis
    41. Market Impact Analysis
    42. Regional Impact
    43. Opportunity and Threat Analysis
    44. US Chip Packaging Market, BY Type (USD Billion)
    45. Fan-Out Wafer-Level Packaging
    46. Fan-In Wafer-Level Packaging
    47. Flip Chip
    48. D/3D
    49. US Chip Packaging Market, BY Application (USD Billion)
    50. Telecommunications
    51. Automotive
    52. Aerospace and Defense
    53. Medical Devices
    54. Consumer Electronics
    55. Competitive Landscape
    56. Overview
    57. Competitive Analysis
    58. Market share Analysis
    59. Major Growth Strategy in the Chip Packaging Market
    60. Competitive Benchmarking
    61. Leading Players in Terms of Number of Developments in the Chip Packaging Market
    62. Key developments and growth strategies
    63. New Product Launch/Service Deployment
    64. Merger & Acquisitions
    65. Joint Ventures
    66. Major Players Financial Matrix
    67. Sales and Operating Income
    68. Major Players R&D Expenditure. 2023
    69. Company Profiles
    70. TSMC
    71. Financial Overview
    72. Products Offered
    73. Key Developments
    74. SWOT Analysis
    75. Key Strategies
    76. Infineon Technologies
    77. Financial Overview
    78. Products Offered
    79. Key Developments
    80. SWOT Analysis
    81. Key Strategies
    82. ASE Group
    83. Financial Overview
    84. Products Offered
    85. Key Developments
    86. SWOT Analysis
    87. Key Strategies
    88. Micron Technology
    89. Financial Overview
    90. Products Offered
    91. Key Developments
    92. SWOT Analysis
    93. Key Strategies
    94. Maxim Integrated
    95. Financial Overview
    96. Products Offered
    97. Key Developments
    98. SWOT Analysis
    99. Key Strategies
    100. Qualcomm
    101. Financial Overview
    102. Products Offered
    103. Key Developments
    104. SWOT Analysis
    105. Key Strategies
    106. Amkor Technology
    107. Financial Overview
    108. Products Offered
    109. Key Developments
    110. SWOT Analysis
    111. Key Strategies
    112. Intel
    113. Financial Overview
    114. Products Offered
    115. Key Developments
    116. SWOT Analysis
    117. Key Strategies
    118. Broadcom
    119. Financial Overview
    120. Products Offered
    121. Key Developments
    122. SWOT Analysis
    123. Key Strategies
    124. Rohm Semiconductor
    125. Financial Overview
    126. Products Offered
    127. Key Developments
    128. SWOT Analysis
    129. Key Strategies
    130. Analog Devices
    131. Financial Overview
    132. Products Offered
    133. Key Developments
    134. SWOT Analysis
    135. Key Strategies
    136. Texas Instruments
    137. Financial Overview
    138. Products Offered
    139. Key Developments
    140. SWOT Analysis
    141. Key Strategies
    142. STMicroelectronics
    143. Financial Overview
    144. Products Offered
    145. Key Developments
    146. SWOT Analysis
    147. Key Strategies
    148. ON Semiconductor
    149. Financial Overview
    150. Products Offered
    151. Key Developments
    152. SWOT Analysis
    153. Key Strategies
    154. NXP Semiconductors
    155. Financial Overview
    156. Products Offered
    157. Key Developments
    158. SWOT Analysis
    159. Key Strategies
    160. References
    161. Related Reports
    162. US Chip Packaging Market SIZE ESTIMATES & FORECAST, BY TYPE, 2019-2035 (USD Billions)
    163. US Chip Packaging Market SIZE ESTIMATES & FORECAST, BY APPLICATION, 2019-2035 (USD Billions)
    164. PRODUCT LAUNCH/PRODUCT DEVELOPMENT/APPROVAL
    165. ACQUISITION/PARTNERSHIP
    166. MARKET SYNOPSIS
    167. US CHIP PACKAGING MARKET ANALYSIS BY TYPE
    168. US CHIP PACKAGING MARKET ANALYSIS BY APPLICATION
    169. KEY BUYING CRITERIA OF CHIP PACKAGING MARKET
    170. RESEARCH PROCESS OF MRFR
    171. DRO ANALYSIS OF CHIP PACKAGING MARKET
    172. DRIVERS IMPACT ANALYSIS: CHIP PACKAGING MARKET
    173. RESTRAINTS IMPACT ANALYSIS: CHIP PACKAGING MARKET
    174. SUPPLY / VALUE CHAIN: CHIP PACKAGING MARKET
    175. CHIP PACKAGING MARKET, BY TYPE, 2025 (% SHARE)
    176. CHIP PACKAGING MARKET, BY TYPE, 2019 TO 2035 (USD Billions)
    177. CHIP PACKAGING MARKET, BY APPLICATION, 2025 (% SHARE)
    178. CHIP PACKAGING MARKET, BY APPLICATION, 2019 TO 2035 (USD Billions)
    179. BENCHMARKING OF MAJOR COMPETITORS

    US Chip Packaging Market Segmentation

     

     

     

    • Chip Packaging Market By Type (USD Billion, 2019-2035)

      • Fan-Out Wafer-Level Packaging
      • Fan-In Wafer-Level Packaging
      • Flip Chip
      • 5D/3D

     

    • Chip Packaging Market By Application (USD Billion, 2019-2035)

      • Telecommunications
      • Automotive
      • Aerospace and Defense
      • Medical Devices
      • Consumer Electronics

     

     

     

     

     

     

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