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    New Packages Materials Power Devices Market

    ID: MRFR/SEM/6025-CR
    175 Pages
    Aarti Dhapte
    July 2025

    New Packages And Materials For Power Devices Market Research Report Information By Product Type (Chip-On-Board (COB), Wire Bonding Packaging, Gallium Arsenide (GaAs), Gallium Nitride (GAN), Silicon Carbide (SIC), Other Packages/Material), By application (Automotive, Consumer Electronics, Industrial, IT & Telecommunications, Military & Aerospace, Others) and By Region (North America, Europe, Asia Pacific, Latin America, Middle East & Africa) – Market Forecast Till 2035

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    New Packages And Materials For Power Devices Market Research Report – Forecast till 2035 Infographic
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    New Packages Materials Power Devices Market Summary

    As per Market Research Future Analysis, the New Packages and Materials for Power Devices Market was valued at 2.88 USD Billion in 2024 and is projected to grow to 6.78 USD Billion by 2035, reflecting a CAGR of 9.44% from 2025 to 2035. The market is driven by the increasing demand for energy-efficient devices, advancements in semiconductor packaging, and the growing electric vehicle sector.

    Key Market Trends & Highlights

    Key trends shaping the New Packages and Materials for Power Devices Market include technological advancements and a shift towards sustainability.

    • Silicon remains the dominant material, valued at 3.0 USD Billion in 2023, expected to grow to 5.0 USD Billion by 2032.
    • Silicon Carbide is projected to increase from 1.5 USD Billion in 2023 to 2.5 USD Billion by 2032.
    • The electric vehicle sector is significantly driving demand for advanced packaging solutions, enhancing efficiency and performance.

    Market Size & Forecast

    2024 Market Size USD 2.88 Billion
    2025 Market Size USD 3.26 Billion
    2032 Market Size USD 6.78 Billion
    CAGR (2025 - 2035) 9.44%

    Major Players

    Key players include STMicroelectronics, Vishay Intertechnology, Infineon Technologies, Power Integrations, and Analog Devices.

    New Packages Materials Power Devices Market Trends

    RISING DEMAND OF SUSTAINABLE AND SCALABLE POWER PRODUCTS

    The global push for sustainability has ignited a transformative surge in the power electronics industry. This growth is driven by the increasing demand for clean energy solutions and energy-efficient products, necessitating the development of more sustainable and scalable power devices. This demand presents a unique opportunity for symbiotic growth: as the market for sustainable power products flourishes, so too does the market for innovative packaging and materials that enable their efficient operation.

    This negates some of the environmental benefits of renewable energy systems and EVs. Here, new materials like Silicon Carbide (SiC) and Gallium Nitride (GaN) emerge as game-changers, boasting superior electrical properties that enable smaller, lighter devices with significantly higher efficiency compared to Si. This translates to lower energy losses, cooler operation, and a smaller environmental footprint for power electronics systems.

    The ongoing evolution of packaging technologies and materials for power devices appears to be driven by the increasing demand for energy efficiency and miniaturization in electronic applications.

    U.S. Department of Energy

    New Packages Materials Power Devices Market Drivers

    Market Growth Projections

    The Global New Packages And Materials For Power Devices Market Industry is projected to experience robust growth over the coming years. With an estimated market value of 2.88 USD Billion in 2024, the industry is set to expand significantly, reaching approximately 6.78 USD Billion by 2035. This growth trajectory suggests a compound annual growth rate (CAGR) of 8.09% from 2025 to 2035, indicating a strong demand for innovative packaging solutions and materials that enhance the performance and efficiency of power devices across various sectors.

    Increased Focus on Miniaturization

    The trend towards miniaturization in electronic devices is a prominent factor affecting the Global New Packages And Materials For Power Devices Market Industry. As consumer electronics become smaller and more powerful, the need for compact and efficient packaging solutions is critical. Innovations in materials and design are enabling manufacturers to create smaller power devices without compromising performance. This shift is likely to enhance the market's growth trajectory, as companies invest in new packaging technologies that cater to the demand for miniaturized electronics across various applications.

    Growing Demand for Energy Efficiency

    The Global New Packages And Materials For Power Devices Market Industry is experiencing a surge in demand for energy-efficient solutions. As industries and consumers increasingly prioritize sustainability, the need for advanced packaging materials that enhance energy efficiency becomes paramount. For instance, the adoption of silicon carbide and gallium nitride technologies is on the rise, as these materials enable higher efficiency and lower energy losses. This trend is projected to contribute to the market's growth, with an estimated value of 2.88 USD Billion in 2024, reflecting a shift towards greener technologies across various sectors.

    Rising Adoption of Electric Vehicles

    The increasing adoption of electric vehicles (EVs) is a key driver for the Global New Packages And Materials For Power Devices Market Industry. As governments worldwide implement stricter emissions regulations, the demand for efficient power devices in EVs is escalating. Advanced packaging materials are essential for optimizing the performance of power electronics in these vehicles, ensuring longer battery life and improved efficiency. This trend is likely to propel the market forward, with an anticipated compound annual growth rate (CAGR) of 8.09% from 2025 to 2035, as manufacturers seek to enhance the capabilities of their EV systems.

    Expansion of Renewable Energy Sources

    The expansion of renewable energy sources is significantly influencing the Global New Packages And Materials For Power Devices Market Industry. As countries strive to meet renewable energy targets, the demand for efficient power devices that can handle variable energy sources is increasing. Advanced packaging materials play a crucial role in ensuring the reliability and efficiency of power electronics used in solar inverters and wind turbines. This growing emphasis on renewable energy is expected to drive market growth, with the industry poised for substantial advancements in packaging technologies to support this transition.

    Technological Advancements in Power Electronics

    Technological innovations in power electronics are driving the Global New Packages And Materials For Power Devices Market Industry forward. The development of new packaging techniques, such as embedded die and 3D packaging, allows for improved thermal management and miniaturization of devices. These advancements facilitate the integration of power devices into compact systems, which is essential for applications in electric vehicles and renewable energy systems. As a result, the market is expected to grow significantly, with projections indicating a value of 6.78 USD Billion by 2035, highlighting the importance of continuous innovation in this sector.

    Market Segment Insights

    Global New Packages And Materials For Power Devices Product Type Insights

    Based on Product Type, New Packages and Materials for Power Devices market is segmented into: On-Board (COB), Wire Bonding Packaging, Gallium Arsenide (GaAs), Gallium Nitride (GAN), Silicon Carbide (SIC), Other Packages/Material. The Silicon Carbide (Sic) segment dominated the global market in 2024, while the Gallium Nitride (Gan) is projected to be the fastest–growing segment during the forecast period.

    Silicon carbide (SiC) power devices are advanced semiconductor components that utilize silicon carbide as the primary material, offering superior performance compared to traditional silicon-based devices. SiC power devices are known for their high efficiency, high voltage operation, and excellent thermal conductivity. These attributes make SiC power devices ideal for high-power and high-temperature applications, where they provide significant benefits in terms of energy efficiency, size reduction, and overall system performance. Several leading companies in the semiconductor industry are actively involved in the manufacturing of SiC power devices, each employing various techniques and materials to optimize performance and reliability.

    Infineon Technologies AG specializes in power electronics and has a strong focus on SiC technology for applications in automotive and industrial sectors. Infineon's SiC power devices include MOSFETs and diodes, designed to enhance efficiency and thermal performance in electric vehicles and renewable energy systems.

    Global New Packages And Materials For Power Devices By Application Insights

    Based on Application, New Packages and Materials for Power Devices market is segmented into: Automotive, Consumer Electronics, Industrial, IT & Telecommunications, Military & Aerospace, Others. The Automotive segment dominated the global market in 2024, while the Consumer Electronics is projected to be the fastest–growing segment during the forecast period.

    In the automotive sector, new packaging and materials for power devices are witnessing substantial growth, driven by the increasing adoption of electric vehicles (EVs) and advanced driver-assistance systems (ADAS). Major companies at the forefront of manufacturing these power devices with innovative packaging and materials include Wolfspeed Inc., Infineon Technologies AG, ON Semiconductor, STMicroelectronics, and Texas Instruments. These companies are leveraging advancements in wide bandgap semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN), to develop power devices that offer superior efficiency, thermal management, and reliability.

    The growth in new packaging and materials for automotive power devices is primarily driven by the stringent requirements of modern automotive applications. EVs, in particular, demand highly efficient power conversion and management systems to maximize battery life and driving range. SiC and GaN technologies are pivotal in meeting these demands due to their higher efficiency and ability to operate at higher temperatures and voltages compared to traditional silicon-based devices. Additionally, the shift towards more sophisticated ADAS and autonomous driving features necessitates advanced power devices that can support complex electronics and sensor systems while maintaining safety and performance standards.

    Figure 1: New Packages And Materials For Power Devices Market, by Grade, 2024 & 2035 (USD BILLION)

    Get more detailed insights about New Packages And Materials For Power Devices Market Research Report – Forecast till 2035

    Key Companies in the New Packages Materials Power Devices Market market include

    Future Outlook

    New Packages Materials Power Devices Market Future Outlook

    The New Packages And Materials For Power Devices Market is projected to grow at 8.09% CAGR from 2024 to 2035, driven by advancements in semiconductor technology and increasing demand for energy efficiency.

    New opportunities lie in:

    • Develop innovative packaging solutions for high-temperature applications.
    • Invest in sustainable materials to meet regulatory demands.
    • Leverage AI for predictive analytics in material performance optimization.

    By 2035, the market is expected to achieve substantial growth, positioning itself as a leader in power device innovation.

    Market Segmentation

    Regional Outlook

    • US
    • Canada
    • Mexico

    Global New Packages And Materials For Power Devices Regional Outlook

    • US
    • Canada
    • Mexico

    New Packages And Materials For Power Devices Market By Application Outlook (USD BILLION, 2019-2035)

    • Automotive
    • Consumer Electronics
    • Industrial
    • IT & Telecommunications
    • Military & Aerospace
    • Others

    New Packages And Materials For Power Devices Market By Product Type Outlook (USD BILLION, 2019-2035)

    • Chip-On-Board (COB)
    • Wire Bonding Packaging
    • Gallium Arsenide (GaAs)
    • Gallium Nitride (GaN)
    • Silicon Carbide (SiC)
    • Other Packages/Material

    Report Scope

    Report Attribute/Metric

    Details

    Market Size 2024

    USD 2.88 BILLION

    Market Size 2025

    USD 3.26 BILLION

    Market Size 2035

    USD 6.78 BILLION

    Compound Annual Growth Rate (CAGR)

    9.44% (2025-2035)

    Base Year

    2024

    Market Forecast Period

    2025-2035

    Historical Data

    2019- 2023

    Market Forecast Units

    Value (USD BILLION)

    Report Coverage

    Revenue Forecast, Market Competitive Landscape, Growth Factors, and Trends

    Segments Covered

    By Product Type, By Application

    Geographies Covered

    North America, Europe, Asia-Pacific, Latin America, Middle East & Africa.

    Countries Covered

    The U.S., Canada, Germany, U.K., France, Russia, Spain, Netherlands, Rest Of Europe, Japan, China, India, South Korea, Singapore, Australia & New Zealand, Rest Of Asia Pacific, Brazil, Mexico, Argentina, Rest of Latin America, South Africa, GCC Countries, Turkey, Israel, Rest of Middle East & Africa, and Africa.

    Key Companies Profiled

    Infineon Technologies, STMICROELECTRONICS, Texas Instruments, Mitsubishi Electric Corporation, Rohm Semiconductor, NXP Semiconductors N.V, Analog Devices, On Semiconductors, Microchip Technology, WOLFSPEED, Inc, among others

    Key Market Opportunities

    ·         Rising demand of sustainable and scalable power products

    Key Market Dynamics

    Demand Of Better Efficiency And Speed, COLLABORATION And PARTNERSHIPS Among Players

    Market Highlights

    Author
    Aarti Dhapte
    Team Lead - Research

    She holds an experience of about 6+ years in Market Research and Business Consulting, working under the spectrum of Information Communication Technology, Telecommunications and Semiconductor domains. Aarti conceptualizes and implements a scalable business strategy and provides strategic leadership to the clients. Her expertise lies in market estimation, competitive intelligence, pipeline analysis, customer assessment, etc.

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    FAQs

    How much is the New Packages And Materials For Power Devices Market?

    The New Packages And Materials For Power Devices Market size is expected to be valued at USD 6.78 BILLION in 2035.

    What is the growth rate of the New Packages And Materials For Power Devices Market?

    The global market is projected to grow at a CAGR of 9.44% during the forecast period, 2024-2035.

    Which region held the largest market share in the New Packages And Materials For Power Devices Market?

    Asia Pacific had the largest share of the global market.

    Who are the key players in the New Packages And Materials For Power Devices Market?

    The key players in the market are Astec Industries Infineon Technologies, STMICROELECTRONICS, Texas Instruments, Mitsubishi Electric Corporation, Rohm Semiconductor, NXP Semiconductors N.V, Analog Devices, On Semiconductors, Microchip Technology, WOLFSPEED, Inc , And among others.

    Which Product Type led the New Packages And Materials For Power Devices Market?

    Silicon Carbide (Sic) dominated the market in 2024.

    Which Application had the largest market share in the New Packages And Materials For Power Devices Market?

    Automotive segment had the largest revenue share of the global market.

    New Packages And Materials For Power Devices Market Research Report – Forecast till 2035 Infographic
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