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  • New Packages Materials Power Devices Companies

    ID: MRFR/SEM/6025-CR
    175 Pages
    Aarti Dhapte
    July 2025

    New Packages and Materials for Power Devices Companies focused on research and development of innovative packaging and materials for advanced power devices and electronics.

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    Top Industry Leaders in the New Packages Materials Power Devices Market

    New Packages and Materials for Power Devices Key Company


    *Disclaimer: List of key companies in no particular order


    Latest Company Updates:


    November 2023- Dana Incorporated, on November 23rd, introduced the company's line of Brevini EvoMax™ helical and bevel helical gearboxes for industrial bulk management applications at the Vrac Tech Exhibition. Brevini EvoMax gearboxes are designed to optimize the performance of mining and bulk material handling equipment such as conveyors, stacker reclaimers, wagon tipplers, and ship loading and unloading equipment. The product range offers a high degree of modularity and flexibility, with torque ratings ranging from 8,000Nm to 310,000Nm. Located in Stand A8, Dana will also promote its full range of support for manufacturers and owners of bulk management equipment, including consulting services, systems design, engineering, procurement, installation, and service.


    November 2023- Micross Components, a leading provider of high-reliability microelectronic products and services for aerospace, defense, space, medical, energy, and other high-reliability applications, is pleased to announce that it has received an award under the IBAS Cornerstone RESHAPE program with a ceiling value of up to USD134.3 million, with USD45.6 million obligated at the time of the award. The award was made through the Department of Defense (DoD) to develop trusted, pure-play, and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging (ASIP) solutions. This effort focuses on Back End Of Line (BEOL) processes for 300mm wafer diameter capabilities aimed at low volume, high mix, secure manufacturing capabilities that all Defense Industrial Base companies can design into their next-generation applications, ensuring access and availability to a U.S. microelectronics ecosystem that enables secure and comprehensive components and system integrations.


    Top listed global companies in the industry are:



    • STMicroelectronics

    • SEMIKRON

    • Efficient Power Conversion Corporation

    • NXP Semiconductor

    • ROHM SEMICONDUCTOR

    • Amkor Technology

    • Littelfuse

    • Remtec Inc.

    • ON Semiconductor

    • MITSUBISHI ELECTRIC CORPORATION

    • Orient Semiconductor Electronics Ltd.

    • ROHM SEMICONDUCTOR

    • Infineon Technologies AG

    • Exagan and others.