*Disclaimer: List of key companies in no particular order
Latest Company Updates:
May 2023
Denso has created its first inverter with SiC chips, for the Lexus RZ e-axle. This inverter will be utilized in the new Lexus RZ. It is a component of the eAxle, an electric drive module created by BluE Nexus Corporation. The RZ, Lexus' first solely focused battery electric vehicle (BEV) model, was just introduced. SiC power semiconductors with Denso's exclusive trench-type MOS structure increase output per chip while lowering power loss brought on by heat generation. Due to the distinctive construction, high voltage and low on-resistance functioning were possible.
Denso uses SiC epitaxial wafers, which are based on the top-notch technology jointly created by Denso and Toyota Central R&D Labs. Thus, Denso has reduced by half the quantity of crystal flaws that result in the device's inability to function normally due to the disorder of the crystal's atomic organization. The quality of SiC power semiconductor devices used in automobiles and their reliable manufacture are guaranteed by eliminating crystal flaws.
Denso employs its SiC technology, which it refers to as "RevoSic," to manufacture products that range from wafers to semiconductor devices and modules like power cards.
February 2023
"TB9083FTG," a gate-driver ICÂ for automotive brushless DC motors used in applications including electric power steering (EPS), electric brakes, and shift-by-wire, has been released by Toshiba Electronic Devices & Storage Corporation.Â
A three-phase brushless DC motor is driven by external N-channel power MOSFETs, which are controlled and driven by the new product TB9083FTG. In order to be used in extremely safety-critical automotive systems, it supports ASIL-D and is highly capable against the functional safety requirements of ISO 26262 second edition. Due to this, the new product is perfect for automotive brushless DC motor applications including EPS, electric brakes, and shift-by-wire.
Top listed global companies in the industry are:
- STMicroelectronics (Switzerland)
- Infineon Technologies (Germany)
- Toshiba Corporation (Japan)
- ON Semiconductor (US)
- Renesas Electronics (Japan)
- Robert Bosch GmbH (Germany)
- NXP Semiconductors (Netherlands)
- Texas Instruments Incorporated (US)
- ROHM Semiconductor (Japan)
- Denso Corporation (Japan)