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    US Power Supply in Package Chip Market

    ID: MRFR/SEM/16594-HCR
    200 Pages
    Garvit Vyas
    October 2025

    US Power Supply in Package Chip Market Research Report By Application (Medical Devices, Automotive, Consumer Electronics, Military and Defense, Telecom and IT) and By Product Type (PSIP, PwrSoc) - Forecast to 2035

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    US Power Supply in Package Chip Market Summary

    As per MRFR analysis, the US power supply-in-package-chip market size was estimated at 357.0 USD Million in 2024.. The US power supply-in-package-chip market is projected to grow from 372.35 USD Million in 2025 to 567.4 USD Million by 2035, exhibiting a compound annual growth rate (CAGR) of 4.3% during the forecast period 2025 - 2035.

    Key Market Trends & Highlights

    The US power supply-in-package-chip market is experiencing a transformative shift towards miniaturization and energy efficiency.

    • The market is witnessing a trend towards the miniaturization of power solutions, driven by the demand for compact electronics.
    • There is an increased focus on energy efficiency, reflecting a broader commitment to sustainable technology.
    • The electric vehicle segment is growing rapidly, indicating a shift in energy consumption patterns and technology integration.
    • Key market drivers include the rising demand for compact electronics and advancements in semiconductor technology.

    Market Size & Forecast

    2024 Market Size 357.0 (USD Million)
    2035 Market Size 567.4 (USD Million)

    Major Players

    Texas Instruments (US), Analog Devices (US), Infineon Technologies (DE), STMicroelectronics (FR), NXP Semiconductors (NL), ON Semiconductor (US), Maxim Integrated (US), Microchip Technology (US), Renesas Electronics (JP)

    US Power Supply in Package Chip Market Trends

    This market is currently experiencing notable growth, driven by the increasing demand for compact and efficient power solutions across various sectors.. This market is characterized by the integration of power management functions within a single package, which enhances performance while reducing space requirements. As technology advances, the need for smaller, more efficient devices continues to rise, prompting manufacturers to innovate and adapt their offerings. The trend towards miniaturization in electronics, coupled with the growing emphasis on energy efficiency, is likely to propel the market forward. Furthermore, the rise of electric vehicles and renewable energy systems is expected to create additional opportunities for power supply-in-package-chip applications, as these sectors require advanced power management solutions to optimize performance and reliability. In addition, the regulatory landscape is evolving, with increasing focus on energy efficiency standards and environmental sustainability. This shift is encouraging manufacturers to invest in research and development to create more efficient power supply solutions. This market appears poised for continued expansion., as stakeholders seek to meet the demands of a rapidly changing technological environment. As the market matures, collaboration between industry players and research institutions may foster innovation, leading to the development of next-generation power supply solutions that address both performance and sustainability concerns.

    Miniaturization of Power Solutions

    The trend towards miniaturization is reshaping the power supply-in-package-chip market. As electronic devices become smaller, the demand for compact power solutions increases. Manufacturers are focusing on integrating multiple functions into a single package, which not only saves space but also enhances efficiency. This trend is particularly evident in consumer electronics and portable devices, where size constraints are critical.

    Increased Focus on Energy Efficiency

    Energy efficiency is becoming a central theme in the power supply-in-package-chip market. With rising energy costs and environmental concerns, there is a strong push for solutions that minimize energy consumption. Manufacturers are developing advanced technologies that optimize power usage, which is likely to appeal to both consumers and businesses seeking to reduce operational costs.

    Growth in Electric Vehicles and Renewable Energy

    The expansion of electric vehicles and renewable energy systems is driving demand for innovative power management solutions. This market is expected to benefit from this growth, as these applications require efficient and reliable power supply solutions.. As the market adapts to these emerging sectors, new opportunities for development and collaboration may arise.

    US Power Supply in Package Chip Market Drivers

    Growth of Smart Grid Technologies

    The expansion of smart grid technologies is creating new opportunities for the power supply-in-package-chip market. As the US transitions towards more intelligent energy systems, the demand for advanced power management solutions is expected to rise. Smart grids require efficient power supply systems that can handle variable energy sources and optimize energy distribution. The market for smart grid technologies is projected to grow at a CAGR of 20% through 2027, indicating a robust demand for innovative power solutions. Power supply-in-package-chips play a crucial role in enabling these technologies by providing compact, efficient, and reliable power management solutions. This growth in smart grid infrastructure is likely to drive the adoption of power supply-in-package-chips, as utilities and energy providers seek to enhance grid reliability and efficiency.

    Regulatory Push for Energy Efficiency

    The power supply-in-package-chip market is significantly impacted by regulatory initiatives aimed at enhancing energy efficiency across various sectors. In the US, government regulations and standards are increasingly mandating higher efficiency levels for electronic devices, particularly in the consumer electronics and automotive industries. For instance, the Energy Star program encourages manufacturers to adopt energy-efficient technologies, which directly influences the design and implementation of power supply solutions. As a result, This market is likely to witness a shift towards more efficient designs that comply with these regulations.. This regulatory push not only promotes sustainability but also drives innovation in power management technologies, as companies strive to meet compliance while maintaining performance and cost-effectiveness.

    Rising Demand for Compact Electronics

    The power supply-in-package-chip market experiences a notable surge in demand driven by the increasing miniaturization of electronic devices. As consumer electronics evolve, manufacturers are compelled to create smaller, more efficient products. This trend is particularly evident in smartphones, wearables, and IoT devices, where space is at a premium. The market for compact electronics is projected to grow at a CAGR of approximately 8% through 2026, indicating a robust appetite for innovative power solutions. Consequently, the power supply-in-package-chip market is positioned to benefit from this trend, as these chips offer a compact form factor without compromising performance. The integration of power management within a single package enhances design flexibility and reduces assembly costs, making it an attractive option for manufacturers aiming to meet consumer demands for smaller devices.

    Increased Adoption of Electric Vehicles

    The power supply-in-package-chip market is poised for growth due to the rising adoption of electric vehicles (EVs) in the US. As the automotive industry shifts towards electrification, the demand for efficient power management solutions becomes paramount. EVs require advanced power supply systems to manage battery charging and energy distribution effectively. The US EV market is projected to reach a value of $100 billion by 2027, with a significant portion of this growth attributed to the need for innovative power solutions. Power supply-in-package-chips are well-suited for this application, offering compact designs that can handle the high power demands of electric drivetrains. This trend indicates a promising future for the power supply-in-package-chip market, as manufacturers seek to develop solutions that meet the evolving needs of the automotive sector.

    Advancements in Semiconductor Technology

    Technological advancements in semiconductor manufacturing are significantly influencing the power supply-in-package-chip market. Innovations such as 3D packaging and system-on-chip (SoC) designs enable the integration of power management functions directly into semiconductor devices. This integration not only enhances performance but also reduces the overall footprint of electronic systems. The semiconductor industry in the US is projected to reach a market value of $500 billion by 2026, with a substantial portion attributed to power management solutions. As semiconductor technology continues to evolve, This market is likely to see increased adoption, driven by the need for efficient power solutions in high-performance applications.. These advancements facilitate the development of more sophisticated power supply solutions that cater to the growing demands of various sectors, including telecommunications and computing.

    Market Segment Insights

    By Product: PSIP (Largest) vs. PwrSoc (Fastest-Growing)

    In the US power supply-in-package-chip market, PSIP holds the largest market share due to its extensive application in various electronic devices and its established reputation for reliability and efficiency. Its ability to meet diverse power needs makes it a preferred choice across industries. Conversely, PwrSoc is rapidly gaining traction among consumers looking for more compact and efficient solutions, contributing to its emergence as a significant player in the market. The growth of the PwrSoc segment can be attributed to increasing demands for miniaturization in electronic devices, pushing manufacturers to innovate and adapt to changing needs. With advancements in technology and a focus on energy efficiency, the demand for PwrSoc continues to rise, positioning it as a vital segment in the market.

    Technology: PSIP (Dominant) vs. PwrSoc (Emerging)

    In the US power supply-in-package-chip market, PSIP stands out as the dominant technology owing to its widespread adoption and proven capabilities in delivering stable power solutions. It is preferred in applications ranging from consumer electronics to automotive systems, demonstrating versatility and robust performance. On the other hand, PwrSoc is viewed as an emerging technology, gaining popularity for its ability to integrate power management functions in a smaller form factor. This innovation appeals to manufacturers aiming to produce sleek and compact devices while ensuring efficient power distribution. As both segments evolve, PSIP maintains its stronghold, but PwrSoc's growth reflects a significant shift toward advanced power solutions in modern electronic design.

    By Application: Consumer Electronics (Largest) vs. Medical Devices (Fastest-Growing)

    In the US power supply-in-package-chip market, Consumer Electronics holds the largest market share due to the widespread adoption and continual innovation within the sector. This segment thrives on the integration of advanced technology in devices such as smartphones, tablets, and smart home applications. On the other hand, Medical Devices are gaining traction, showcasing a robust growth trajectory as healthcare technology advances and the need for compact, efficient power solutions escalates. The growth trends in the market reflect a significant shift towards higher efficiency and miniaturization in power solutions across all segments. The automotive sector is increasingly adopting advanced systems, driven by electric vehicle demand, while Telecom and IT are experiencing steady growth due to rising infrastructure investments. Medical Devices, identified as the fastest-growing segment, capitalize on innovation and heightened healthcare needs, propelling their demand in the market.

    Consumer Electronics: Dominant vs. Medical Devices: Emerging

    Consumer Electronics stands out as the dominant segment in the US power supply-in-package-chip market, driven by ongoing innovations and consumer demand for smart, compact devices. The growth in this category is spurred by rapid technological advancement, making power solutions smaller and more efficient. Conversely, Medical Devices have emerged as a significant player due to the increasing focus on health tech solutions. The rising complexity of medical devices requires reliable and advanced power supplies to ensure performance and safety. As regulatory standards evolve and technology improves, the potential for growth in medical applications is substantial, making it an appealing area for manufacturers looking to expand their offerings.

    Get more detailed insights about US Power Supply in Package Chip Market

    Key Players and Competitive Insights

    The power supply-in-package-chip market is currently characterized by a dynamic competitive landscape, driven by technological advancements and increasing demand for efficient power management solutions. Key players such as Texas Instruments (US), Analog Devices (US), and ON Semiconductor (US) are at the forefront, each adopting distinct strategies to enhance their market positioning. Texas Instruments (US) focuses on innovation, particularly in developing integrated circuits that optimize energy efficiency, while Analog Devices (US) emphasizes partnerships with technology firms to expand its product offerings. ON Semiconductor (US) is actively pursuing mergers and acquisitions to bolster its capabilities in power management solutions, thereby shaping a competitive environment that is increasingly collaborative and innovation-driven.

    The market structure appears moderately fragmented, with several players vying for market share. Key business tactics include localizing manufacturing to reduce costs and enhance supply chain resilience. This strategy not only mitigates risks associated with The power supply-in-package-chip market demands. The collective influence of these major players fosters a competitive atmosphere where innovation and operational efficiency are paramount.

    In October 2025, Texas Instruments (US) announced the launch of a new line of power management ICs designed for automotive applications. This strategic move is significant as it aligns with the growing trend towards electrification in the automotive sector, positioning the company to capture a larger share of this burgeoning market. The introduction of these ICs is expected to enhance energy efficiency in electric vehicles, thereby reinforcing Texas Instruments' commitment to innovation in power management.

    In September 2025, Analog Devices (US) entered into a strategic partnership with a leading AI technology firm to integrate AI capabilities into its power management solutions. This collaboration is likely to enhance the performance and efficiency of power supply-in-package chips, reflecting a broader trend towards the integration of AI in semiconductor technologies. Such initiatives may provide Analog Devices with a competitive edge in a market increasingly focused on smart technology solutions.

    In August 2025, ON Semiconductor (US) completed the acquisition of a smaller semiconductor firm specializing in advanced power management technologies. This acquisition is indicative of ON Semiconductor's strategy to expand its product portfolio and enhance its technological capabilities. By integrating these advanced technologies, the company aims to offer more comprehensive solutions to its customers, thereby strengthening its market position.

    As of November 2025, current competitive trends in the power supply-in-package-chip market are heavily influenced by digitalization, sustainability, and the integration of AI technologies. Strategic alliances are becoming increasingly vital, as companies recognize the need to collaborate to drive innovation and meet evolving customer demands. Looking ahead, competitive differentiation is expected to shift from traditional price-based competition to a focus on technological innovation, supply chain reliability, and sustainability initiatives. This evolution suggests that companies that prioritize these aspects will likely emerge as leaders in the market.

    Key Companies in the US Power Supply in Package Chip Market market include

    Industry Developments

    In the US Power Supply in Package Chip Market, there have been significant recent developments, particularly related to key players such as Microchip Technology, Advanced Micro Devices, Infineon Technologies, and Texas Instruments. For instance, in September 2023, Microchip Technology announced a new series of power management solutions aimed at enhancing energy efficiency in automotive applications, responding to increasing market demand for high-performance chips. Additionally, Advanced Micro Devices revealed plans in August 2023 to expand its production capacity to meet the rising needs of consumer electronics, which reflects overall growth in the semiconductor sector.

    Moreover, there were reports of increased mergers and acquisitions. In July 2023, Infineon Technologies acquired Cypress Semiconductor, bolstering its position in the power supply segment. Similarly, ON Semiconductor has been actively pursuing strategic partnerships to leverage advanced technologies in power efficiency. Market valuations are climbing, driven by increased application of power supply chips in electric vehicles and renewable energy sectors. As of the last two years, regulations are also pushing manufacturers towards eco-friendly solutions, thereby impacting growth trajectories and innovation within the market.

    Future Outlook

    US Power Supply in Package Chip Market Future Outlook

    The power supply-in-package-chip market is projected to grow at a 4.3% CAGR from 2024 to 2035, driven by advancements in semiconductor technology and increasing demand for compact solutions.

    New opportunities lie in:

    • Development of integrated power management solutions for IoT devices.
    • Expansion into renewable energy applications for enhanced efficiency.
    • Partnerships with automotive manufacturers for electric vehicle power systems.

    By 2035, the market is expected to achieve robust growth, driven by innovation and strategic partnerships.

    Market Segmentation

    US Power Supply in Package Chip Market Product Outlook

    • PSIP
    • PwrSoc

    US Power Supply in Package Chip Market Application Outlook

    • Medical Devices
    • Automotive
    • Consumer Electronics
    • Military and Defense
    • Telecom and IT

    Report Scope

    MARKET SIZE 2024 357.0(USD Million)
    MARKET SIZE 2025 372.35(USD Million)
    MARKET SIZE 2035 567.4(USD Million)
    COMPOUND ANNUAL GROWTH RATE (CAGR) 4.3% (2024 - 2035)
    REPORT COVERAGE Revenue Forecast, Competitive Landscape, Growth Factors, and Trends
    BASE YEAR 2024
    Market Forecast Period 2025 - 2035
    Historical Data 2019 - 2024
    Market Forecast Units USD Million
    Key Companies Profiled Texas Instruments (US), Analog Devices (US), Infineon Technologies (DE), STMicroelectronics (FR), NXP Semiconductors (NL), ON Semiconductor (US), Maxim Integrated (US), Microchip Technology (US), Renesas Electronics (JP)
    Segments Covered Product, Application
    Key Market Opportunities Integration of advanced semiconductor technologies enhances efficiency in the power supply-in-package-chip market.
    Key Market Dynamics Technological advancements drive innovation in power supply-in-package-chip, enhancing efficiency and performance across applications.
    Countries Covered US

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    FAQs

    What is the expected market size of the US Power Supply in Package Chip Market in 2024?

    The US Power Supply in Package Chip Market is expected to be valued at 375.0 million USD in 2024.

    What is the projected market valuation for the US Power Supply in Package Chip Market by 2035?

    By 2035, the market is expected to reach a valuation of 650.0 million USD.

    What is the anticipated compound annual growth rate (CAGR) for the US Power Supply in Package Chip Market from 2025 to 2035?

    The market is expected to grow at a CAGR of 5.128% during the forecast period from 2025 to 2035.

    Which application segment holds the largest revenue share in the US Power Supply in Package Chip Market for 2024?

    The Consumer Electronics segment is projected to generate 110.0 million USD in 2024, holding the largest share.

    How much is the Medical Devices application segment expected to grow between 2024 and 2035?

    The Medical Devices segment is expected to grow from 65.0 million USD in 2024 to 120.0 million USD by 2035.

    Which key players are leading the US Power Supply in Package Chip Market?

    Major players include Microchip Technology, Qualcomm, Infineon Technologies, and Texas Instruments.

    What is the projected market value for the Automotive segment in 2035?

    The Automotive application segment is expected to reach a market value of 150.0 million USD by 2035.

    What is the expected market size for the Telecom and IT segment in 2024?

    The Telecom and IT segment is expected to be valued at 70.0 million USD in 2024.

    How much is the Military and Defense segment projected to be worth in 2035?

    The Military and Defense segment is projected to have a market value of 85.0 million USD by 2035.

    What impact do current global scenarios have on the growth of the US Power Supply in Package Chip Market?

    Current global scenarios may influence supply chain dynamics but the market is anticipated to continue its growth trajectory.

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