Power Supply in Package and Power Supply on Chip Companies

The Competitive Landscape of the Power Supply in Package and Power Supply on Chip Market

The Power Supply in Package (PSiP) and Power Supply on Chip (PwrSoC) market, offering integrated power conversion solutions for electronic devices, pulsates with innovation and dynamic competition. By miniaturizing and integrating power management circuitry directly into packages or onto chips, PSiP and PwrSoC technologies address miniaturization needs, improve efficiency, and simplify board design, attracting players across various industries.

Some of the Power Supply in Package and Power Supply on Chip companies listed below:

• Bel Fuse Inc.


• Texas Instruments Incorporated


• ON Semiconductor


• Panasonic Corporation


• Vicor Corporation


• Jiangsu Changjiang Electronics Technology Co. Ltd.


• Amkor Technology


• TDK Corporation


• Intel Corporation


• ASE Group

Strategies Adopted by Leaders

• Portfolio Diversification: Offering a wide range of PSiP and PwrSoC solutions in different packages, power ratings, and functionalities caters to diverse application needs and expands market reach.


• Technological Innovation and Integration: Continuous R&D focuses on advancements like higher power density, improved efficiency, advanced control algorithms, and integration with additional features like EMI shielding and over-temperature protection.


• Focus on Specific Applications and Verticals: Targeting segments like mobile devices, automotive electronics, medical devices, and wearables with specialized PSiP or PwrSoC solutions builds expertise and attracts key customers.


• Strategic Partnerships and Collaborations: Partnering with chipmakers, system integrators, and technology providers accelerates technology adoption, expands distribution channels, and fosters joint development projects.


• Focus on Quality and Reliability: Ensuring rigorous manufacturing processes, high-quality materials, and comprehensive testing procedures builds trust and opens doors to critical applications demanding precise and reliable performance.

Factors for Market Share Analysis:

• Performance and Efficiency: Delivering solutions with superior power density, conversion efficiency, low standby power, and fast transient response sets players apart for demanding applications requiring performance and energy optimization.


• Integration and Footprint: Offering highly integrated PSiP or PwrSoC solutions with small footprints enables easy integration into space-constrained devices and simplifies board design.


• Cost-Effectiveness and Price Point: Striking a balance between performance, features, and competitive pricing is crucial for attracting budget-conscious customers and expanding market penetration in cost-sensitive sectors.


• Customization and Design Flexibility: Providing customizable solutions and design flexibility caters to specific application requirements and enables integration into diverse systems.


• Regulatory Compliance and Ecosystem Integration: Ensuring adherence to relevant industry standards and safety regulations, offering compatible solutions, and actively contributing to industry standards and consortia fosters trust and ecosystem compatibility.

New and Emerging Companies:

• Niche Market Focus: Targeting specific segments like ultra-low-power PSiP for IoT devices, high-voltage PwrSoC for industrial applications, or integrated solutions for wearable electronics opens up new market opportunities.


• Focus on Emerging Technologies: Integrating technologies like gallium nitride (GaN) for higher efficiency, advanced packaging materials for thermal management, and AI-powered design optimization positions them at the forefront of future market trends.


• Direct-to-Customer Online Sales: Utilizing online platforms and social media marketing enables them to bypass traditional distribution channels and reach customers directly, often with more flexible engagement models.


• Open-Source Design and Collaboration: Utilizing open-source design platforms and fostering collaboration with developers attracts talent and facilitates rapid innovation.

Industry Developments:

Sep. 18, 2023- Enachip, a semiconductor microdevice company, announced it has raised $7.1 million in venture funds to commercialize its Wafer Level technology platform and advanced products to enable Power-Supply-on-Chip (PwrSoC) and Power-System-in-Package (PSiP).

May 22, 2023- Infineon Technologies announced receiving a €60mEuropean project, The ALL2GaN, with 45 partners to develop integrated GaN power designs from the chip to the module for supply from Europe.

The ALL2GaN project aims to use AI to strengthen sustainable industry and secure European supply chains for gallium nitride (GaN) power technologies. This three-year project is focused on integrating GaN chips and Infineon's toolbox using individual GaN chip elements, high-performance GaN modules, chip designs, and novel system-on-chip approaches.

Mar. 21, 2023- Nvidia, TSMC, ASML, and Synopsis announced collaboration on software to speed up chipmaking. Nvidia's new software is designed to help ADLS, TSMC, and Synopsis to speed up chip production. Nvidia announced a cuLitho software library for computational lithography at GTC 2023 that TSMC will deploy for its fabrication work starting in June. Nvidia is also working with ASML and Synopsis on cuLitho to help move chips to 2nm while reducing the carbon footprint at fabs.

Sep.13, 2022- Edge Impulse and Infineon announced their machine learning software support for PSoC 6 microcontrollers. This cross-platform will support their software environments, allowing for high-powered, flexible machine-learning development on the Infineon PSoC 6 microcontroller series. The partnership expands Infineon's ModusToolbox software ecosystem to Edge Impulse's studio environment, allowing easy configuration of the high-performance, low-power PSoC 6 MCU series for edge ML applications.