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The global electronics industry is currently undergoing a transformative phase, marked by stringent regulations concerning environmental impact and the increasing emphasis on energy efficiency. This shift has given rise to key developments such as the miniaturization and convergence of everyday electronic devices. Miniaturization is a critical aspect of modern electronics, involving the reduction in size of various components, including connectors, sockets, and other integral parts, while maintaining functionality and performance. In this landscape, Liquid Crystal Polymer (LCP) connectors have emerged as pivotal components, offering unique solutions that cater to the demands of high-precision injection molding in electronic manufacturing.
One of the driving factors behind the increasing demand for miniaturization in the electronics industry is the need for compliance with environmental regulations and the pursuit of energy-efficient solutions. The miniaturization trend encompasses a meticulous consideration of input/output ports and various components in the assembly, essential for the final product's functionality. LCP connectors have proven to be instrumental in meeting the challenges posed by miniaturization, particularly due to their ability to support high pin density and other ultrathin parts.
The physical properties of LCP make it particularly well-suited for high-temperature applications in miniaturized electronic devices. LCP exhibits excellent flow properties, allowing for precise injection molding as its molecules are oriented in the flow direction. Furthermore, the extremely low thermal expansion coefficient of LCP renders it ideal for applications requiring different soldering techniques, including vapor phase (wave) and infrared (reflow/through-hole) soldering. The injection molding process for LCP packages is efficient, with mold cycle times under 10 seconds, making it conducive to high-efficiency manufacturing approaches.
Another noteworthy characteristic of LCP is its compatibility with pre-molded packages, as it can withstand temperatures exceeding 300° C. The inherent fire resistance of LCP adds an extra layer of safety to electronic components, meeting crucial industry standards. Moreover, LCP, being a thermoplastic, is recyclable, aligning with sustainability goals in manufacturing.
The unique combination of properties, such as high-temperature resistance, excellent flow characteristics, low thermal expansion coefficient, and recyclability, positions LCP connectors as an ideal solution for the miniaturization requirements in the electronics industry. As electronic devices continue to evolve with a focus on compactness and efficiency, LCP connectors are poised to play a pivotal role in driving the growth of the LCP connector market.
In conclusion, the increasing trend of miniaturizing electrical components in the electronics industry is creating a demand for specialized materials and solutions. LCP connectors, with their exceptional physical properties, are not only meeting these demands but also contributing to the evolution of high-performance, compact electronic devices. As the electronics landscape continues to advance, the LCP connector market is anticipated to experience substantial growth, driven by the critical role these connectors play in the miniaturization processes essential for modern electronic manufacturing.
Covered Aspects:
| Report Attribute/Metric | Details |
|---|---|
| Market Opportunities | The growing demand for thin and small connectors, along with the application from the consumer electronics and telecommunication sector, is likely to create opportunities for market players. |
LCP Connectors Market Highlights:
LCP Connectors Market Overview
The global LCP connectors market has been expected to rise at a CAGR of 8.1%, with a value of USD 6,448.4 million over the forecasted 2020-2027.
Liquid crystal polymer is a super engineering plastic with high strength, modulus and impact properties, flame retardance, resistance to a wide range of aggressive chemicals, and very low and tailor-able coefficients of the thermal expansion, excellent dimensional stability, thin-wall flow-ability, and unique processability. With the miniaturization trend of many electronic products, manufacturers are streamlining devices to pack more features into smaller packages. For instance, the pitch between contacts in electrical connectors is narrower than ever before and as small as 0.2 mm, compared to older-style power connectors, with gradients exceeding 12.0 mm.
For the same reasons, LCPs are also injection molded into an integrated circuit socket, high-frequency network switches, power modules for wind and solar inverters and converters, custom high-power electrical connectors, and many other precision devices. Daily use of electric equipment, like cell phones, laptops, or tablet PCs, is increasing rapidly. At present, these devices are becoming more powerful and inexpensive from generation to generation while decreasing in size and weight. The LCP delivers the properties that permit the successful development of the miniaturization of the electrical equipment.
Market Synopsis
This MRFR perspective presents a holistic assessment for global LCP connectors market. The assessment includes a revenue forecast till 2023. Macro and microeconomics factors effecting the market has been discussed in the research document. The scope of the discussion also covers different types of LCP connectors. The document comprises ten chapters that highlight critical viewpoints. Market dynamic and market factor analysis are also available in the document. It also includes a country-level analysis across key regions of the world.
Companies Covered
Sumitomo Chemical Company, Amphenol Corporation, Wurth Group (Wurth Elektronik), 3M Company, Japan Aviation Electronics Industry, Ltd., Hirose Electric Co. Ltd., Celanese Corporation, RTP Company, HARTING Technology Group, TE Connectivity Ltd., OMRON Corporation, Asia International Enterprise (HK) Limited, Cinch Connectivity Solutions, Polyplastics Co. Ltd, Axon' Cable, Solvay SA and Molex Inc.
The report provides insights on the leading market players and evaluates their current market share. Company information with regards to revenue, segmental share, geographical income, SWOT, growth strategies, new product launch, M&A activities, and the latest R&D initiatives is also available in the report.
Research Methodology
MRFR utilizes a robust research methodology. Market sizing and revenue projections are undertaken using a complex but fail-safe research system. This system is a combination of primary and secondary research activities. A range of options is considered for gathering impactful market information and data. Proprietary sources such as white papers, encyclopedia, SEC filings, annual reports, etc. are consulted for identifying mission-critical facts. Further, interactions with subject matter experts through telephonic, email and face-to-face interviews allows confirmation of research findings. For ensuring high credibility of the study, a multi-level verification technique is used. Use of bottom-up and top-down approaches ensure representation of correct market foresights.
Other Description
- Market Denomination- USD Mn
- Base Year- 2017
- Forecast Period- from 2018 to 2023
For the scope of the research, MRFR’s report offers a comprehensive segmental analysis of the global market for LCP connector
By Connector Type Outlook
- Rectangular Connectors
- Circular Connectors
- Card Edge Connectors
- Backplane Connectors
- Modular Connectors
- Heavy Duty Power Connectors
- FFC, FPC Connectors
- D-Shaped Connectors
- Coaxial Connectors
- Power Connectors
- Memory Connectors
- Fiber Optic Connectors
- Pluggable Connectors
- USB, DVI, HDMI connectors
- Blade-Type Power Connectors
- Solid-State Lighting Connectors
By Region Outlook
- North America
- Europe
- Asia Pacific
- Rest of the World (RoW)
Recent Development
- The global LDP connectors market is partially consolidated, with the top five players accounting for over 80% of the worldwide production. The key player in the global LCP market includes Polyplastics Co. Ltd, Celanese Corporation, Sumitomo Chemical Company, Kuraray, UENO FINE CHEMICALS INDUSTRY LTD., and others.
February 2022
- Amphenol Corporation announced the first quarter dividend on its common stock in the amount of USD 0.20 per share at its meeting. The company will pay this first quarter 2022 dividend in April 2022 to the shareholders of record as of March 2022.
Intended Audience
- Manufacturers and distributors of liquid crystal polymers.
- Suppliers and traders of liquid crystal polymers.
- Government, associations and industrial bodies.
- Investors and trade experts.
- Consulting in chemical experts.
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