Electronic Packaging Market Research Report Information By Material (Plastic, Metal, Glass, and others), Packaging Technology (Through-Hole Mounting, Surface Surface-Mount Technology [SMD] and Chip-Scale Packages [CSP]), End User (Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication, and others) and Region (North America, Europe, Asia-Pacific and Rest of the World) - Industry Forecast till 2032

Table of Contents

1. Executive Summary

2. Scope of the Report

2.1. Market Definition

2.2. Scope of the Study

2.2.1. Research Objectives

2.2.2. Assumptions & Limitations

2.3. Markets Structure

3. Market Research Methodology

3.1. Research Process

3.2. Secondary Research

3.3. Primary Research

3.4. Forecast Model

4. Market Landscape

4.1. Porter’s Five Forces Analysis

4.1.1. Threat of New Entrants

4.1.2. Bargaining Power of Buyers

4.1.3. Threat of Substitutes

4.1.4. Intensity of Rivalry

4.1.5. Bargaining Power of Suppliers

4.2. Value Chain/Supply Chain of the Global Electronic Packaging Market

5. Market Overview of the Global Electronic Packaging Market

5.1. Introduction

5.2. Growth Drivers

5.3. Impact Analysis

5.4. Market Challenges

6. Market Trends

6.1. Introduction

6.2. Growth Trends

6.3. Impact Analysis

7. Global Electronic Packaging Market, by Material

7.1. Introduction

7.2. Plastic

7.2.1. Market Estimates & Forecast, 2024-2032

7.2.2. Market Estimates & Forecast, by Region, 2024-2032

7.3. Metal

7.3.1. Market Estimates & Forecast, 2024-2032

7.3.2. Market Estimates & Forecast, by Region, 2024-2032

7.4. Glass

7.4.1. Market Estimates & Forecast, 2024-2032

7.4.2. Market Estimates & Forecast, by Region, 2024-2032

7.5. Others

7.5.1. Market Estimates & Forecast, 2024-2032

7.5.2. Market Estimates & Forecast, by Region, 2024-2032

8. Global Electronic Packaging Market, by Packaging Technology

8.1. Introduction

8.2. Through Hole Mounting

8.2.1. Market Estimates & Forecast, 2024-2032

8.2.2. Market Estimates & Forecast, by Region, 2024-2032

8.3. Surface Surface-Mount Technology (SMD)

8.3.1. Market Estimates & Forecast, 2024-2032

8.3.2. Market Estimates & Forecast, by Region, 2024-2032

8.4. Chip Scale Packages (CSP)

8.4.1. Market Estimates & Forecast, 2024-2032

8.4.2. Market Estimates & Forecast, by Region, 2024-2032

9. Global Electronic Packaging Market, by End User

9.1. Introduction

9.2. Consumer Electronics

9.2.1. Market Estimates & Forecast, 2024-2032

9.2.2. Market Estimates & Forecast, by Region, 2024-2032

9.3. Aerospace & Defence

9.3.1. Market Estimates & Forecast, 2024-2032

9.3.2. Market Estimates & Forecast, by Region, 2024-2032

9.4. Automotive

9.4.1. Market Estimates & Forecast, 2024-2032

9.4.2. Market Estimates & Forecast, by Region, 2024-2032

9.5. Telecommunication

9.5.1. Market Estimates & Forecast, 2024-2032

9.5.2. Market Estimates & Forecast, by Region, 2024-2032

9.6. Others

9.6.1. Market Estimates & Forecast, 2024-2032

9.6.2. Market Estimates & Forecast, by Region, 2024-2032

10. Global Electronic Packaging Market, by Region

10.1. Introduction

10.2. North America

10.2.1. Market Estimates & Forecast, by Country, 2024-2032

10.2.2. Market Estimates & Forecast, by Material, 2024-2032

10.2.3. Market Estimates & Forecast, by Packaging Technology, 2024-2032

10.2.4. Market Estimates & Forecast, by End User, 2024-2032

10.2.5. US

10.2.5.1. Market Estimates & Forecast, by Material, 2024-2032

10.2.5.2. Market Estimates & Forecast, by Packaging Technology, 2024-2032

10.2.5.3. Market Estimates & Forecast, by End User, 2024-2032

10.2.6. Canada

10.2.6.1. Market Estimates & Forecast, by Material, 2024-2032

10.2.6.2. Market Estimates & Forecast, by Packaging Technology, 2024-2032

10.2.6.3. Market Estimates & Forecast, by End User, 2024-2032

10.2.7. Mexico

10.2.7.1. Market Estimates & Forecast, by Material, 2024-2032

10.2.7.2. Market Estimates & Forecast, by Packaging Technology, 2024-2032

10.2.7.3. Market Estimates & Forecast, by End User, 2024-2032

10.3. Europe

10.3.1. Market Estimates & Forecast, by Country, 2024-2032

10.3.2. Market Estimates & Forecast, by Material, 2024-2032

10.3.3. Market Estimates & Forecast, by Packaging Technology, 2024-2032

10.3.4. Market Estimates & Forecast, by End User, 2024-2032

10.3.5. UK

10.3.5.1. Market Estimates & Forecast, by Material, 2024-2032

10.3.5.2. Market Estimates & Forecast, by Packaging Technology, 2024-2032

10.3.5.3. Market Estimates & Forecast, by End User, 2024-2032

10.3.6. Germany

10.3.6.1. Market Estimates & Forecast, by Material, 2024-2032

10.3.6.2. Market Estimates & Forecast, by Packaging Technology, 2024-2032

10.3.6.3. Market Estimates & Forecast, by End User, 2024-2032

10.3.7. France

10.3.7.1. Market Estimates & Forecast, by Material, 2024-2032

10.3.7.2. Market Estimates & Forecast, by Packaging Technology, 2024-2032

10.3.7.3. Market Estimates & Forecast, by End User, 2024-2032

10.3.8. UK

10.3.8.1. Market Estimates & Forecast, by Material, 2024-2032

10.3.8.2. Market Estimates & Forecast, by Packaging Technology, 2024-2032

10.3.8.3. Market Estimates & Forecast, by End User, 2024-2032

10.3.9. Italy

10.3.9.1. Market Estimates & Forecast, by Material, 2024-2032

10.3.9.2. Market Estimates & Forecast, by Packaging Technology, 2024-2032

10.3.9.3. Market Estimates & Forecast, by End User, 2024-2032

10.3.10. Rest of Europe

10.3.10.1. Market Estimates & Forecast, by Material, 2024-2032

10.3.10.2. Market Estimates & Forecast, by Packaging Technology, 2024-2032

10.3.10.3. Market Estimates & Forecast, by End User, 2024-2032

10.4. Asia-Pacific

10.4.1. Market Estimates & Forecast, by Country, 2024-2032

10.4.2. Market Estimates & Forecast, by Material, 2024-2032

10.4.3. Market Estimates & Forecast, by Packaging Technology, 2024-2032

10.4.4. Market Estimates & Forecast, by End User, 2024-2032

10.4.5. China

10.4.5.1. Market Estimates & Forecast, by Material, 2024-2032

10.4.5.2. Market Estimates & Forecast, by Packaging Technology, 2024-2032

10.4.5.3. Market Estimates & Forecast, by End User, 2024-2032

10.4.6. Japan

10.4.6.1. Market Estimates & Forecast, by Material, 2024-2032

10.4.6.2. Market Estimates & Forecast, by Packaging Technology, 2024-2032

10.4.6.3. Market Estimates & Forecast, by End User, 2024-2032

10.4.7. India

10.4.7.1. Market Estimates & Forecast, by Material, 2024-2032

10.4.7.2. Market Estimates & Forecast, by Packaging Technology, 2024-2032

10.4.7.3. Market Estimates & Forecast, by End User, 2024-2032

10.4.8. Rest of Asia-Pacific

10.4.8.1. Market Estimates & Forecast, by Material, 2024-2032

10.4.8.2. Market Estimates & Forecast, by Packaging Technology, 2024-2032

10.4.8.3. Market Estimates & Forecast, by End User, 2024-2032

10.5. Rest of the World

10.5.1. Market Estimates & Forecast, by, Country, 2024-2032

10.5.2. Market Estimates & Forecast, by Material, 2024-2032

10.5.3. Market Estimates & Forecast, by Packaging Technology, 2024-2032

10.5.4. Market Estimates & Forecast, by End User, 2024-2032

10.5.5. The Middle East & Africa

10.5.5.1. Market Estimates & Forecast, by Material, 2024-2032

10.5.5.2. Market Estimates & Forecast, by Packaging Technology, 2024-2032

10.5.5.3. Market Estimates & Forecast, by End User, 2024-2032

10.5.6. South America

10.5.6.1. Market Estimates & Forecast, by Material, 2024-2032

10.5.6.2. Market Estimates & Forecast, by Packaging Technology, 2024-2032

10.5.6.3. Market Estimates & Forecast, by End User, 2024-2032

11. Company Profiles

11.1. AMETEK Inc.

11.1.1. Company Overview

11.1.2. Product/Business Segment Overview

11.1.3. Financial Updates

11.1.4. Key Developments

11.1.5. SWOT Analysis

11.1.6. Key Strategies

11.2. Dordan Manufacturing Company

11.2.1. Company Overview

11.2.2. Product/Business Segment Overview

11.2.3. Financial Updates

11.2.4. Key Developments

11.2.5. SWOT Analysis

11.2.6. Key Strategies

11.3. DuPont de Nemours, Inc.

11.3.1. Company Overview

11.3.2. Product/Business Segment Overview

11.3.3. Financial Updates

11.3.4. Key Developments

11.3.5. SWOT Analysis

11.3.6. Key Strategies

11.4. GY Packaging,

11.4.1. Company Overview

11.4.2. Product/Business Segment Overview

11.4.3. Financial Updates

11.4.4. Key Developments

11.4.5. SWOT Analysis

11.4.6. Key Strategies

11.5. Plastiform Inc.

11.5.1. Company Overview

11.5.2. Product/Business Segment Overview

11.5.3. Financial Updates

11.5.4. Key Developments

11.5.5. SWOT Analysis

11.5.6. Key Strategies

11.6. Kiva Container Corporation

11.6.1. Company Overview

11.6.2. Product/Business Segment Overview

11.6.3. Financial Updates

11.6.4. Key Developments

11.6.5. SWOT Analysis

11.6.6. Key Strategies

11.7. Primex Design & Fabrication

11.7.1. Company Overview

11.7.2. Product/Business Segment Overview

11.7.3. Financial Updates

11.7.4. Key Developments

11.7.5. SWOT Analysis

11.7.6. Key Strategies

11.8. Quality Foam Packaging Inc.

11.8.1. Company Overview

11.8.2. Product/Business Segment Overview

11.8.3. Financial Updates

11.8.4. Key Developments

11.8.5. SWOT Analysis

11.8.6. Key Strategies

11.9. Sealed Air Corporation

11.9.1. Company Overview

11.9.2. Product/Business Segment Overview

11.9.3. Financial Updates

11.9.4. Key Developments

11.9.5. SWOT Analysis

11.9.6. Key Strategies

11.10. The Box Co-Op

11.10.1. Company Overview

11.10.2. Product/Business Segment Overview

11.10.3. Financial Updates

11.10.4. Key Developments

11.10.5. SWOT Analysis

11.10.6. Key Strategies

11.11. UFP Technologies, Inc.

11.11.1. Company Overview

11.11.2. Product/Business Segment Overview

11.11.3. Financial Updates

11.11.4. Key Developments

11.11.5. SWOT Analysis

11.11.6. Key Strategies

11.12. Intel Corporation

11.12.1. Company Overview

11.12.2. Product/Business Segment Overview

11.12.3. Financial Updates

11.12.4. Key Developments

11.12.5. SWOT Analysis

11.12.6. Key Strategies

11.13. STMicroelectronics NV

11.13.1. Company Overview

11.13.2. Product/Business Segment Overview

11.13.3. Financial Updates

11.13.4. Key Developments

11.13.5. SWOT Analysis

11.13.6. Key Strategies

11.14. Xilinx Inc.

11.14.1. Company Overview

11.14.2. Product/Business Segment Overview

11.14.3. Financial Updates

11.14.4. Key Developments

11.14.5. SWOT Analysis

11.14.6. Key Strategies

11.15. Samsung Electronics Corporation Ltd

11.15.1. Company Overview

11.15.2. Product/Business Segment Overview

11.15.3. Financial Updates

11.15.4. Key Developments

11.15.5. SWOT Analysis

11.15.6. Key Strategies

11.16. ams AG

11.16.1. Company Overview

11.16.2. Product/Business Segment Overview

11.16.3. Financial Updates

11.16.4. Key Developments

11.16.5. SWOT Analysis

11.16.6. Key Strategies

11.17. Taiwan Semiconductor Manufacturing Co. Ltd

11.17.1. Company Overview

11.17.2. Product/Business Segment Overview

11.17.3. Financial Updates

11.17.4. Key Developments

11.17.5. SWOT Analysis

11.17.6. Key Strategies

12. Conclusion

LIST OF TABLES

Table1 Global Electronic Packaging Market, by Country, 2020-2027

Table2 North America: Electronic Packaging Market, by Country, 2024-2032

Table3 Europe: Electronic Packaging Market, by Country, 2024-2032

Table4 Asia-Pacific: Electronic Packaging Market, by Country, 2024-2032

Table5 South America: Electronic Packaging Market, by Country, 2024-2032

Table6 North America: Electronic Packaging Market, by Country, 2024-2032

Table7 North America: Electronic Packaging Market, by Material, 2024-2032

Table8 North America: Electronic Packaging Market, by Packaging Technology, 2024-2032

Table9 North America: Electronic Packaging Market, by End User, 2024-2032

Table10 Europe: Electronic Packaging Market, by Country, 2024-2032

Table11 Europe: Electronic Packaging Market, by Material, 2024-2032

Table12 Europe: Electronic Packaging Market, by Application, 2024-2032

Table13 Europe: Electronic Packaging Market, by End User, 2024-2032

Table14 Asia-Pacific: Electronic Packaging Market, by Country, 2024-2032

Table15 Asia-Pacific Electronic Packaging Market, by Material, 2024-2032

Table16 Asia-Pacific: Electronic Packaging Market, by Application, 2024-2032

Table17 Asia-Pacific: Electronic Packaging Market, by End User, 2024-2032

Table18 Middle East & Africa: Electronic Packaging Market, by Country, 2024-2032

Table19 Middle East & Africa: Electronic Packaging Market, by Material, 2024-2032

Table20 Middle East & Africa: Electronic Packaging Market, by Application, 2024-2032

Table21 Middle East & Africa: Electronic Packaging Market, by End User, 2024-2032

Table22 South America: Electronic Packaging Market, by Country, 2024-2032

Table23 South America: Electronic Packaging Market, by Material, 2024-2032

Table24 South America: Electronic Packaging Market, by Application, 2024-2032

Table25 South America: Electronic Packaging Market, by End User, 2024-2032

LIST OF FIGURES

Figure 1 Global Electronic Packaging Market Segmentation

Figure 2 Forecast Methodology

Figure 3 Porter’s Five Forces Analysis of the Global Electronic Packaging Market

Figure 4 Value Chain of the Global Electronic Packaging Market

Figure 5 Share of the Global Electronic Packaging Market in 2020, by country (in %)

Figure 6 Global Electronic Packaging Market, 2024-2032

Figure 7 Share of the Global Electronic Packaging Market by Industry, 2024-2032

Figure 8 Global Electronic Packaging Market Size, by Material, 2020

Figure 9 Share of the Global Electronic Packaging Market, by Material, 2024-2032

Figure 10 Global Electronic Packaging Market Size, by Application, 2020

Figure 11 Share of the Global Electronic Packaging Market, by Application, 2024-2032

Figure 12 Global Electronic Packaging Market Size, by End User, 2020

Figure 13 Share of the Global Electronic Packaging Market, by End User, 2024-2032