Electronic Packaging Market Research Report Information By Material (Plastic, Metal, Glass, and others), Packaging Technology (Through-Hole Mounting, Surface Surface-Mount Technology [SMD] and Chip-Scale Packages [CSP]), End User (Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication, and others) and Region (North America, Europe, Asia-Pacific and Rest of the World) - Industry Forecast till 2032

Electronic Packaging Market Overview

Global Electronic Packaging Market is estimated to reach USD 3.12 billion by 2032, registering a CAGR of 18.51% during the forecast period of 2024–2032. Interconnecting chips and electronic components into a microsystem is referred to as electronic packaging. Diodes, ICs, amplifiers, rectifiers, and chips are used in microsystems to protect internal components from shocks, water, and fire, among other things. Electronic goods and gadgets are packaged in this manner. Electronic packaging incorporates communication ICs, memory power management devices, analog, digital, mixed-signal ICs, and die shrinks in the same package to drive applications in clinical diagnostics, therapy, and medical imaging. Integrating electronics offers up a world of possibilities for the human interface, and higher-density, more energy-efficient battery technologies suggest that the electronic packaging market share will expand dramatically in the coming years.

The term electronic packaging refers to the design and manufacture of enclosures for electronic equipment ranging from single semiconductors to whole systems such as mainframe computers. Mechanical damage, cooling, radio frequency noise emission, and electrostatic discharge are all protected by this. To guard against electrostatic discharge, water, harsh weather conditions, corrosion, and dust, efficient electrical and semiconductor packaging is utilized throughout the manufacturing of consumer electronic goods such as smartphones, TVs, tablets, set-top boxes, and digital media adapters. It is employed in a variety of army and aerospace facilities that contain semiconductor devices, such as information handling units, information screen systems, and aircraft control units, since it allows for reduced board area, weight, and PCB routing complexity.

COVID 19 Analysis

Electronic package manufacturers have been forced to halt production due to government limitations implemented in the aftermath of the COVID-19 epidemic, which has disrupted the broader semiconductor manufacturing and supply chain. The COVID-19 epidemic has caused a drop in Electronic Packaging Market Demand. Due to the lockdown situation, gadget manufacturing has come to a halt. The worldwide Electronic Packaging Market's whole supply chain has been disrupted as a result of this. The Electronic Packaging Industry, on the other hand, sees an opportunity in the current crisis, as companies begin to work from home and end-users consume more information on digital platforms, increasing the need for storage and memory solutions for data centers, laptops, and other devices. The Electronic Packaging Industry is currently driven by the use of medical devices with integrated electronic packaging for bio-imaging and clinical diagnostics. After the shutdown and transportation restrictions are eased, companies that manufacture ICs and semiconductor devices are expected to update production planning, sourcing strategy, and change industry dynamics to drive growth, thus increasing the Electronic Packaging Market Size and Electronic Packaging Market Share.

Electronic Packaging Market Dynamics

Market Drivers

One of the primary factors driving the market's growth and Electronic Packaging Market Demand is the rising demand for consumer electronics around the world. Additionally, the industry is growing due to the increasing adoption of smartphones around the world during the Electronic Packaging Market Forecast. The growing use of IoT and wireless devices around the world, as well as developments in these technologies, are all contributing to the worldwide electronic packaging market's growth. The market is primarily driven by the increased usage of consumer electronic gadgets such as smartphones, tablets, wearable devices, televisions, and digital cameras that include new packaging materials such as air bubble wraps and air pillows to protect against harsh weather conditions. Demand for all-weather protective packaging for fragile electronic equipment including routers, network servers, and sensors is also propelling the electronic packaging market forward.

Market Restraints

Some of the challenges that are limiting the market's growth and decreasing the Electronic Packaging Market Key Players are worries about heat dissipation and the initial high cost of electronic packaging. The demand for high-quality military-grade packaging in the aerospace and defense sector for naval warships, satellite communication on-board channels, weapon control systems, data display systems, and aircraft guidance-control assemblies, on the other hand, is driving the electronic packaging market revenue. The growth of the IoT network market, as well as continuous R&D investments to enable more productive electronic and semiconductor packaging, are likely to open up new opportunities for the electronic packaging sector. However, potential reliability difficulties, such as stress sensitivity and complicated, difficult defect repair after components are soldered into the circuit board, tend to limit market expansion.

Technology Analysis

Leading electronic packaging companies to use the essential methodologies to produce cutting-edge solutions for the integration of flexible electronics, such as high-capacity batteries, and to provide compact electronic packaging. Curtiss-Wright, a global diversified product manufacturer and service provider, announced a new family of tiny Data Acquisition Systems (DAC) in May 2020 to provide system designers with a balanced square form factor. In electric and hybrid vehicles, electronic packaging of a large number of memory devices, processors, discrete power devices, sensors, analog, and digital circuits is integrated, revolutionizing the automotive landscape by transitioning from mechanical to electronic assemblies.

Electronic Packaging Market Segment Overview

The Global Electronic Packaging Market is further bifurcated into various segments depending on various factors to help the market to grow as per the predicted CAGR growth by the end of the forecast period in 2030. The Global Electronic Packaging Market is segmented based on the following:

Electronic Packaging Material

• Plastic


• Metal


• Glass


• Others

Electronic Packaging Packaging Technology

• Through-hole mounting


• Surface-mount technology (SMD)


• Chip-scale packages (CSP)

Electronic Packaging End User

• Consumer electronics


• Aerospace & defense


• Automotive


• Telecommunication


• Others

Electronic Packaging Region

• North America


• Europe


• Asia-Pacific


• The Rest of the World

Regional Classifiaction

Due to increased consumer electronics demand across the region, Asia-Pacific dominated the market during the historic forecast period and is likely to continue to do so over the forecast period. Furthermore, the existence of numerous electronic packaging firms offering electronic packaging material and technology, such as Samsung Electronics Corporation Ltd and Taiwan Semiconductor Manufacturing Co. Ltd, boosts the market in the area even further. Furthermore, expanding population and rising disposable income in the region are two important reasons driving up demand for consumer electronics, which is boosting the electronic packaging market in the region even faster. Furthermore, the region's global supremacy in semiconductor device manufacture is a crucial market driver. Major semiconductor packaging market players have manufacturing facilities in Asia-Pacific, which has accelerated the development of electronic packaging technologies and made products more accessible to the market. China, Japan, India, and the rest of Asia-Pacific are the countries that make up the area. During the historic forecast period, China dominated the market, followed by India. Additionally, government-backed programs and investments aimed at fostering cutting-edge technology and creating semiconductor packaging solutions help to propel the market forward.

Electronic Packaging Market Key Player & Competitive Landscape

Electronic packaging is a fragmented market. Microsystems are utilized in practically every industrial vertical, with consumer electronics, healthcare equipment, aerospace and defense, communications, and so on being some of the most important. Semiconductor devices, such as integrated circuits (ICs), have become an intrinsic element of machines as electronics have grown more integrated, resulting in a huge increase in electronic packaging. The Major Players continue to innovate and invest in R&D to offer a cost-effective product selection. There have been recent mergers and acquisitions among the major players, a tactic used by businesses to expand their consumer base. The major Electronic Packaging Market Key Players are as follows:

• AMETEK Inc.


• Dordan Manufacturing Company


• DuPont de Nemours, Inc.


• GY Packaging


• Plastiform Inc.


• Kiva Container Corporation


• Quality Foam Packaging Inc.


• Sealed Air Corporation


• The Box Co-Op.


• UFP Technologies, Inc.


• Intel Corporation


• Primex Design & Fabrication


• STMicroelectronics NV


• Xilinx Inc.


• Samsung Electronics Corporation Ltd.


• AMS AG


• Taiwan Semiconductor Manufacturing Co. Ltd.

Electronic Packaging Industry Developments

• FMH Aerospace was bought by Ametek and was a leader in the manufacturing of specialized and engineered components for aerospace, space, and defense applications. The purchased entity's more than 100 aerospace and defense projects might open up a slew of lucrative defense and aerospace options for the corporation.


• The EnerChip solid-state rechargeable micro-battery and the next generation of Power Management with RTC (PMRTC) products were introduced by Cymbet Corp., which is a leader in thin-film solid-state storage devices and energy harvesting technology. This device combines an ultra-low-power real-time clock (RTC) with power management and power switching, making it ideal for battery-free sensors and wearable sensors.


• January 2024, the global styrenics company INEOS Styrolution announced the launch of a new grade of methyl methacrylate butadiene styrene, which is called Zylar. The material has been named Zylar EX350, and it is designed for carrier tapes used in packaging electronic components because it offers a balance between stiffness and toughness. This extrusion-grade material allows for greater design flexibility as well as an optimal protection level and support for electronic components. It also enables deeper pockets to be made with more rigidity than can be achieved using a general-purpose polystyrene/styrene-butadiene copolymer blend, thereby offering greater versatility to meet diverse market needs.


• February 2024, Intel Corp (INTC) today launched Intel Foundry as a more sustainable systems foundry business built for the AI era and unveiled an expanded process roadmap aimed at securing leadership into the second half of this decade. The business likewise showed customer momentum and support from partners in the ecosystem — like Synopsys, Cadence, Siemens and Ansys — who shared their preparedness to expedite chip design for Intel Foundry customers with tools, design flows, and IP portfolios verified for Intel’s advanced packaging and Intel 18A process technologies.


• September 2023, Samsung Electronics and Thom Browne announced their latest collaboration: Galaxy Z Fold5 Thom Browne Edition. Merging style with substance, this release showcases an unwavering commitment to quality — along with additional accessories that bring an air of refinement fit for a table at the most exclusive gala. Striking yet welcoming, each piece is crafted with expert care and premium materials. Limited quantities are available.


• DuPont today announced that Coryor Surface Treatment Company Ltd., together with Nippon Paint Taiwan, have introduced printed Tedlar® PVF solutions & PVF coating at the Taipei Building Show - Taiwan’s largest building materials exhibition. For printed PVF film solutions featured at the show, DuPont worked very closely with Coryor Surface Treatment Co. This innovative PVF product made with Tedlar® is one of the application series AAMALON® from Coryor, which focused on better weathering resistance, among other performance benefits. With over 60 years of durability in the harshest environments, Tedlar® films are proven performers.

Electronic Packaging Market Report Overview

The research provides an analytical analysis of the Electronic Packaging market forecast, including current trends and future projections, to identify potential investment opportunities. The study includes information on major drivers, restraints, and opportunities, as well as a full market analysis of electronic packaging. The present electronic packaging market trends are objectively examined. The analysis depicts the market's potency of buyers and providers.