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    US Molded Interconnect Device Market

    ID: MRFR/SEM/15729-HCR
    200 Pages
    Garvit Vyas
    October 2025

    US Molded Interconnect Device Market Research Report By Product Type (Antennae and Connectivity Modules, Sensors, Connectors and Switches, Lighting System, Others), By Process (Laser Direct Structuring (LDS), Two-shot Molding, Film Techniques) and By Vertical (Telecommunication, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace) - Forecast to 2035

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    US Molded Interconnect Device Market Infographic
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    US Molded Interconnect Device Market Summary

    The US Molded Interconnect Device market is poised for substantial growth, reaching an estimated value of 1642.7 USD Million by 2035.

    Key Market Trends & Highlights

    US Molded Interconnect Device Key Trends and Highlights

    • The market valuation is projected to grow from 380.8 USD Million in 2024 to 1642.7 USD Million by 2035.
    • The compound annual growth rate (CAGR) is anticipated to be 14.21% from 2025 to 2035.
    • This market growth is likely driven by increasing demand for compact and efficient electronic components.
    • Growing adoption of advanced manufacturing technologies due to the need for enhanced product performance is a major market driver.

    Market Size & Forecast

    2024 Market Size 380.8 (USD Million)
    2035 Market Size 1642.7 (USD Million)
    CAGR (2025-2035) 14.21%

    Major Players

    Hirose Electric, Lcom, Bel Fuse, Samtec, Littelfuse, Amphenol, TE Connectivity, Provertha, Phoenix Contact, Cinch Connectivity Solutions, Connectors and Sensors, 3M, AVX Corporation, Molex, JST

    US Molded Interconnect Device Market Trends

    The US Molded Interconnect Device market is experiencing significant growth driven by several key market drivers. One of the primary factors is the increasing demand for compact and efficient electronic devices, as manufacturers seek solutions that integrate multiple functions in a single package. The need for lighter and smaller components is pushing businesses to adopt molded interconnect devices in automotive, consumer electronics, and telecommunications sectors. Moreover, advancements in materials technology are enabling the production of more durable and thermally stable molded interconnect devices, thereby expanding their applicability and reliability in various applications.

    Additionally, there are ample opportunities to be explored in the area of electric vehicles and renewable energy systems, where molded interconnect devices can support the integration of numerous electrical components while optimizing space and weight. The ongoing transition towards automation and smart technologies across industries further creates a demand for innovative interconnect solutions that can facilitate advanced functionalities in devices, indicating a ripe landscape for growth. Trends in recent times also highlight an increased focus on sustainability within the US market.

    There is a growing awareness regarding the environmental impact of electronic waste, leading companies to prioritize eco-friendly materials and manufacturing processes.This is complemented by regulatory initiatives from the US government promoting sustainable practices in electronics manufacturing. 

    As the market evolves, businesses are now looking towards recyclable materials and energy-efficient production methods to meet both consumer demands and regulatory requirements. Overall, the US Molded Interconnect Device market continues to adapt to technological advancements and changing consumer preferences, placing it at the forefront of innovation.

    Market Segment Insights

    Molded Interconnect Device Market Product Type Insights

    The US Molded Interconnect Device Market has been increasingly segmented based on Product Type, showcasing a diverse landscape that responds to a multitude of technological needs and consumer demands. Each category plays an essential role in the market dynamics, with Antennae and Connectivity Modules leading in terms of innovation and application, especially due to advancing connectivity solutions required for the Internet of Things (IoT) and smart devices. This segment is critical as it integrates functionalities that ensure seamless communication between devices, which is vital in a rapidly digitizing environment.

    Similarly, the Sensors segment has gained traction, driven by the proliferation of smart technologies across industries like automotive and healthcare, where accurate data collection has become imperative. 

    Sensors empower devices to interpret their surroundings, driving efficiencies and enhanced performance in various applications. Connectors and Switches represent another significant segment, ensuring robust connections within electronic systems, which are fundamental in maintaining functionality and performance reliability across numerous applications. The Lighting System component has also witnessed substantial growth, fueled by increasing emphasis on energy-efficient solutions and smart lighting technologies in residential and commercial setups. 

    This market aspect aligns with global sustainability trends and regulatory pushes towards energy conservation. Finally, the Others segment encapsulates an array of additional products that cater to niche applications, reflecting the versatility and adaptability of the Molded Interconnect Device technology. The overall market segmentation reveals substantial growth potential in avenues that leverage technological advancement, supporting the US's competitive position in the global electronics landscape.

    Source: Primary Research, Secondary Research, MRFR Database and Analyst Review

    Molded Interconnect Device Market Process Insights

    The Process segment of the US Molded Interconnect Device Market plays a crucial role in the growth and advancement of the industry. Laser Direct Structuring (LDS) is gaining traction due to its ability to create more complex and miniaturized designs, which are essential for modern electronic applications such as smartphones and wearable devices. Two-shot Molding, on the other hand, allows for the integration of multiple materials in a single production cycle, enhancing functionality and reducing assembly time, making it a preferred choice for manufacturers aiming for efficiency.

    Film Techniques continue to be significant as they enable the creation of intricate circuit patterns on flexible substrates, catering to the increasing demand for lightweight and compact electronic devices. Collectively, these processes capitalize on technological innovations and the rising need for compact, multifunctional electronic solutions in various sectors, including consumer electronics, automotive, and healthcare. The focus on improving production efficiency and product performance through these advanced techniques underscores their importance in shaping the future landscape of the US Molded Interconnect Device Market.

    Molded Interconnect Device Market Vertical Insights

    The US Molded Interconnect Device Market is experiencing robust growth, particularly across various verticals including Telecommunication, Consumer Electronics, Automotive, Medical, Industrial, and Military and Aerospace. The telecommunications sector, driven by the push for faster internet connectivity and advanced network solutions, plays a significant role in shaping market dynamics, as modern infrastructure increasingly relies on molded interconnect devices for connectivity and reliability.

    Meanwhile, the consumer electronics sector benefits from growing demand for compact and lightweight designs, which molded interconnect devices can effectively provide, enhancing user experiences.In the automotive industry, the shift towards electric and autonomous vehicles highlights the importance of molded interconnect devices for improved efficiency, safety, and onboard technologies. 

    The medical vertical capitalizes on these devices' reliability and precision in critical healthcare applications, further emphasizing their importance within this sector. Additionally, the industrial segment leverages molded interconnect devices to optimize automation processes, while the military and aerospace sectors rely on rugged, high-performance components that molded interconnect devices can offer.Overall, as technological advancements continue, the combined contributions of these sectors drive significant opportunities within the US Molded Interconnect Device Market, reflecting a robust market landscape.

    Get more detailed insights about US Molded Interconnect Device Market

    Key Players and Competitive Insights

    The US Molded Interconnect Device Market represents a dynamic and competitive landscape, characterized by continuous technological advancements and innovation. This market consists of manufacturers and suppliers who produce integrated solutions that combine electrical interconnections and molded designs, thus enhancing performance and reliability. The competition is shaped by factors such as product quality, pricing strategies, customer service, and the ability to adapt to evolving industry demands. Market participants invest in research and development to create new products that cater to various applications, including telecommunications, consumer electronics, automotive, and industrial sectors. 

    Understanding the competitive landscape is essential for stakeholders looking to establish or expand their presence in this growing market.Hirose Electric plays a significant role in the US Molded Interconnect Device Market, boasting a strong reputation for high-quality and innovative interconnect solutions. The company is known for its advanced technology and wide range of products that cater to various sectors such as telecommunications, automotive, and industrial applications. Hirose Electric leverages its extensive experience in the industry to provide reliable and robust products that meet stringent customer requirements.

    The company's strengths lie in its focus on research and development, allowing them to introduce cutting-edge products that enhance performance and reliability. 

    Moreover, Hirose Electric’s commitment to customer service and support further solidifies its standing in the market, enabling the company to maintain strong relationships with its clientele while addressing their unique interconnect needs.Lcom is another prominent player in the US Molded Interconnect Device Market, recognized for its extensive portfolio of connectivity solutions, particularly in the field of networking and telecom. The company offers a variety of products, including cables, connectors, and patch panels that cater to the growing demands of industrial and commercial markets.

    Lcom’s strengths are evident in its robust market presence and reputation for delivering reliable and efficient products that excel in performance. 

    The company has strategically engaged in mergers and acquisitions to broaden its product offerings and enhance its technological capabilities, positioning itself further as a leader in the industry. With a strong customer-centric approach and a commitment to quality, Lcom continues to develop innovative solutions, thereby solidifying its presence in the competitive landscape of the US Molded Interconnect Device Market.

    Key Companies in the US Molded Interconnect Device Market market include

    Industry Developments

    The US Molded Interconnect Device Market has experienced significant developments recently. In September 2023, Hirose Electric announced the launch of a new line of compact and modular connectors designed for improved performance in harsh environments, indicating an ongoing trend towards enhanced product robustness. In August 2023, Lcom introduced high-frequency RF cables aimed at the telecommunications sector, reflecting the growing demand for high-performance connectivity solutions. 

    Furthermore, in October 2022, Amphenol completed the acquisition of an advanced interconnect technology company, strengthening its portfolio and market position. The market is witnessing a growth spurt, driven by rising applications in automotive, telecommunications, and industrial electronics, with projections indicating an upward valuation trajectory through 2024. Companies like Littelfuse and TE Connectivity are also expanding their product offerings to cater to evolving industry standards. The increasing emphasis on miniaturization and efficiency in electronic devices further propels the market dynamics.

    As of July 2023, industry reports highlighted a surge in demand for molded interconnect devices resulting from increased automation and smart technologies integration in various sectors across the United States.

    Market Segmentation

    Outlook

    • Antennae and Connectivity Modules
    • Sensors
    • Connectors and Switches
    • Lighting System
    • Others

    Molded Interconnect Device Market Process Outlook

    • Laser Direct Structuring (LDS)
    • Two-shot Molding
    • Film Techniques

    Molded Interconnect Device Market Vertical Outlook

    • Telecommunication
    • Consumer Electronics
    • Automotive
    • Medical
    • Industrial
    • Military & Aerospace

    Molded Interconnect Device Market Product Type Outlook

    • Antennae and Connectivity Modules
    • Sensors
    • Connectors and Switches
    • Lighting System
    • Others

    Report Scope

    Report Attribute/Metric Source: Details
    MARKET SIZE 2018 333.45 (USD Million)
    MARKET SIZE 2024 380.8 (USD Million)
    MARKET SIZE 2035 1642.65 (USD Million)
    COMPOUND ANNUAL GROWTH RATE (CAGR) 14.212% (2025 - 2035)
    REPORT COVERAGE Revenue Forecast, Competitive Landscape, Growth Factors, and Trends
    BASE YEAR 2024
    MARKET FORECAST PERIOD 2025 - 2035
    HISTORICAL DATA 2019 - 2024
    MARKET FORECAST UNITS USD Million
    KEY COMPANIES PROFILED Hirose Electric, Lcom, Bel Fuse, Samtec, Littelfuse, Amphenol, TE Connectivity, Provertha, Phoenix Contact, Cinch Connectivity Solutions, Connectors and Sensors, 3M, AVX Corporation, Molex, JST
    SEGMENTS COVERED Product Type, Process, Vertical
    KEY MARKET OPPORTUNITIES Miniaturization of electronic components, Rising demand for consumer electronics, Expansion in automotive applications, Growth in IoT devices, Increased focus on energy efficiency
    KEY MARKET DYNAMICS growing demand for miniaturization, increasing automation in manufacturing, rising need for cost-effective solutions, advancements in material technology, expansion of electric vehicle market
    COUNTRIES COVERED US

    FAQs

    What is the expected market size of the US Molded Interconnect Device Market in 2024?

    The US Molded Interconnect Device Market is expected to be valued at 380.8 million USD in 2024.

    What will be the market size of the US Molded Interconnect Device Market by 2035?

    By 2035, the market size is projected to reach 1,642.65 million USD.

    What is the expected compound annual growth rate (CAGR) for the US Molded Interconnect Device Market between 2025 and 2035?

    The expected CAGR for the market from 2025 to 2035 is 14.212%.

    Which product type is projected to have the highest market value in 2035 within the US Molded Interconnect Device Market?

    The Antennae and Connectivity Modules segment is projected to be valued at 426.5 million USD in 2035.

    Who are the key players in the US Molded Interconnect Device Market?

    Major players in the market include Hirose Electric, Lcom, Bel Fuse, Samtec, and Amphenol, among others.

    What will be the market value of the Sensors segment in 2024?

    The Sensors segment is expected to be valued at 90.0 million USD in 2024.

    How much is the Lighting System segment expected to grow by 2035?

    The Lighting System segment is projected to grow to 297.8 million USD by 2035.

    What are some growth drivers for the US Molded Interconnect Device Market?

    Key growth drivers include advancements in connectivity technology and increased demand for smart devices.

    What is the projected market value for Connectors and Switches in 2035?

    The market value for Connectors and Switches is expected to reach 360.2 million USD by 2035.

    What challenges might impact the US Molded Interconnect Device Market in the coming years?

    Challenges may include supply chain disruptions and rising material costs affecting production.

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