SiC Wafer Polishing Market is expected to grow USD 6.454 Billion by 2032 | MRFR

Increasing demand for SiC wafers in the semiconductor industry due to their superior electrical and thermal properties is expected to drive market expansion in the near future at a CAGR of 38.20% during the forecast period 2023 to 2032.

Market Research Future (MRFR) has published a cooked research report on the “Global SiC Wafer Polishing Market” that contains information from 2018 to 2032. The SiC Wafer Polishing market is estimated to register a CAGR of 38.20% during the forecast period of 2024 to 2032.

MRFR recognizes the following companies as the key players in the global SiC Wafer Polishing market— 3M, Advanced Abrasives Corporation, AGC Inc., Engis Corporation, Entegris, Ferro Corporation, Fujifilm Holdings America Corporation, Fujimi Incorporated, Iljin Diamond Co., Ltd., JSR Corporation, Kemet International Limited, Lapmaster Wolters, Logitech Ltd., Shanghai Xinanna Electronic Technology Co., Ltd, SKC.

SiC Wafer Polishing Market Highlights

The global SiC Wafer Polishing market is accounted to register a CAGR of 38.20% during the forecast period and is estimated to reach USD 6.454 billion by 2032.

SiC wafers are being extensively used in power electronics, electric vehicles, and renewable energy applications, which is propelling the demand for high-quality polished wafers. Moreover, as SiC-based devices gain prominence in emerging technologies like 5G, electric vehicles, and industrial automation, the need for advanced SiC wafers with precise surface quality and flatness is driving the market's growth. The continual advancements in wafer polishing techniques and equipment to achieve tighter tolerances and higher yields are further contributing to the market's expansion.

Segment Analysis

The global SiC Wafer Polishing market has been segmented based on process type, product type and application.

On the basis of process type, the market is segmented into Chemical-Mechanical Polishing (CMP), Electropolishing, Chemical Polishing, Plasma-Associated Polishing and Others. The chemical-mechanical polishing (CMP) segment was attributed to holding the largest market share in 2022, due to its well-established and proven track record in the semiconductor industry.

Based on product type, the global SiC Wafer Polishing market has been segmented into Abrasive powders, Polishing Pads, Diamond Slurries, Colloidal Silica Suspensions and Others. The abrasive powders segment was expected to hold the largest market share in 2022, due to their effectiveness in removing material and achieving smooth, flat surfaces.

Based on application, the global SiC Wafer Polishing market has been segmented into Power Electronics, Light-Emitting Diodes (LEDs), Sensors and Detectors, Rf and Microwave Devices and Others. The power electronics segment was expected to hold the largest market share in 2022, due to the increasing demand for SiC wafers in power semiconductor devices.

Browse In-depth Details [Table of Content, List of Figures, List of Tables] of SiC Wafer Polishing Market Research Report

Regional Analysis

The global SiC Wafer Polishing market, based on region, has been divided into the North America, Europe, Asia-Pacific, and Rest of the World. North America consists of US and Canada. The Europe SiC Wafer Polishing market comprises of Germany, France, the UK, Italy, Spain, and the rest of Europe. The SiC Wafer Polishing market in Asia-Pacific has been segmented into China, India, Japan, Australia, South Korea, and the rest of Asia-Pacific. The Rest of the World SiC Wafer Polishing market comprises of Middle East, Africa, and Latin America.

The largest market share for SiC Wafer Polishing was maintained by the North American regional sector. This increase is attributed to the increasing adoption of SiC-based power electronics in electric vehicles, renewable energy systems, and aerospace applications. These industries demand high-quality SiC wafers with exceptional surface smoothness and uniformity to enhance device performance. Additionally, government initiatives and investments in clean energy technologies are accelerating the growth of SiC wafer polishing as SiC wafers enable more efficient and compact power electronics, aligning with sustainability goals.

Moreover, the Europe market has been persistently growing over the forecast period. The demand for SiC Wafer Polishing is driven by the increasing adoption of SiC-based power electronics and semiconductor devices in various applications, such as electric vehicles and renewable energy systems, to achieve higher energy efficiency, and the growing emphasis on reducing greenhouse gas emissions and transitioning to sustainable energy sources.

Additionally, Asia Pacific is anticipated to experience the quickest growth over the forecast period due to the region's increasing adoption of SiC-based power devices in applications like electric vehicles, renewable energy, and high-frequency electronics. As Asia Pacific countries aim to reduce carbon emissions and enhance energy efficiency, there's a growing need for SiC wafers with superior electrical and thermal properties, spurring market growth. Additionally, the presence of key semiconductor manufacturers and a focus on technology innovation in countries contribute to the expansion of the SiC wafer polishing market in the region.

Furthermore, the rest of the world's SiC Wafer Polishing market is divided into the Middle East, Africa, and Latin America. This growth is attributed to the region's increasing interest in renewable energy sources and the growing demand for SiC-based power electronics in applications such as solar inverters and electric vehicles.

Key Findings of the Study

• The global SiC Wafer Polishing market is expected to reach USD 6.454 billion by 2032, at a CAGR of 38.20% during the forecast period.


• The Asia-Pacific region accounted for the fastest-growing global market due to the region's increasing adoption of SiC-based power devices in applications like electric vehicles, renewable energy, and high-frequency electronics.


• Based on product type, the abrasive powders segment was attributed to holding the largest market in 2022, with an approximate market share of 45–65%.


• 3M, Advanced Abrasives Corporation, AGC Inc., Engis Corporation, Entegris, Ferro Corporation, Fujifilm Holdings America Corporation, Fujimi Incorporated, Iljin Diamond Co., Ltd., JSR Corporation, Kemet International Limited, Lapmaster Wolters, Logitech Ltd., Shanghai Xinanna Electronic Technology Co., Ltd, SKC.