Expansion of newly developed materials for semiconductor packing is expected to drive market expansion in the near future at a CAGR of 14.50% during the forecast period 2023 to 2032

Market Research Future (MRFR) has published on the “Global Packaging and Assembly Equipment Market”.

The packaging and assembly equipment market is estimated to register a CAGR of 14.50% during the forecast period of 2023 to 2032.

MRFR recognizes the following companies as the key players in the global packaging and assembly equipment market - Amkor Technology, Tokyo Electron Limited, Lam, Research Corporation, ASML Holding N.V, Applied Materials, KLA-Tencor, Hitachi High-Technologies Corporation, Advantest, Screen Holdings Co. Ltd., and Teradyne Inc.

Packaging and Assembly Equipment Market Highlights

The global packaging and assembly equipment market is accounted to register a CAGR of 14.50% during the forecast period and is estimated to reach USD 35.517 billion by 2032.

Packaging and assembly equipment markets are being driven by the increasing use of advanced integrated chips in various industries, such as healthcare, automotive, consumer electronics, industrial, and aerospace. Additionally, throughout the projected period, the market will expand because to SC's increasing demand to install them for multifunctioning. Furthermore, the worldwide packaging and assembly market is expected to be favorably fuelled by ongoing research and development as well as the expanding use of electronic devices including tablets, laptops, and mobile phones.

Segment Analysis

The global packaging and assembly equipment market has been segmented into application, end-user and type.

On the basis of application, the market is segmented into Consumer Electronics, Healthcare Devices, Automotive, Enterprise Storage, Other Applications. The consumer electronics segment was attributed to holding the largest market share in 2022. For the electronics industry's stringent standards, this equipment guarantees accurate assembly, testing, and packing. Innovations in this field are generally driven by the need for sophisticated packaging solutions.

Based on end-user, the global packaging and assembly equipment market has been segmented into OSATs and IDMs. The OSATs segment was expected to hold the largest market share in 2022. A number of variables, including the rise in shipments of power devices, the rise in packages found in smartphones, and the prevalence of electronic material in autos, are driving the need for this industry.

On the basis of type, the market is segmented into Plating Equipment, Inspection and Dicing Equipment, Wire Bonding Equipment, Die-Bonding Equipment. The plating equipment segment was attributed to holding the largest market share in 2022. The manufacturing of electronic devices, such as computers, laptops, and mobile phones, is growing. Other factors that have contributed to the packing equipment segment's acceptability are the growth in shipment activities, rising OSAT and IDM, and growing manufacturing.

Regional Analysis

The global packaging and assembly equipment market, based on region, has been divided into the North America, Europe, Asia-Pacific, and Rest of the World. North America consists of US and Canada. The Europe packaging and assembly equipment market comprises of Germany, France, the UK, Italy, Spain, and the rest of Europe. The packaging and assembly equipment market in Asia-Pacific has been segmented into China, India, Japan, Australia, South Korea, and the rest of Asia-Pacific. The Rest of the World packaging and assembly equipment market comprises of Middle East, Africa, and Latin America.

The largest market share for packaging and assembly equipment was maintained by the North American regional sector because of the growing demand from end-use industries including communications equipment (cellular phones), consumer electronics (televisions), computers & laptops (desktops/notebooks), and medical devices. Expanding their product offerings is a key strategy for competitors in the industry to establish a distinctive market positioning and cater to a diverse clientele.

Moreover, the Europe market has been persistently growing over the forecast period because of the growing exports from the pharmaceutical industry. This region can get the product from the country because of its superior production capacity and technical advancements. With an increase in product exports, the nation will require more packaging equipment to meet market demand.

Additionally, Asia Pacific is anticipated to experience the quickest growth over the forecast period. In order to take advantage of the new growth opportunities presented by the increasing popularity of tablets and wearable technology, the packaging and assembly equipment business is attempting to expand its operations in China, South Korea, and India. It is anticipated that government support will further energize the local market.

Furthermore, the rest of the world's packaging and assembly equipment market is divided into the Middle East, Africa, and Latin America. The rest of the world's market for packaging and assembly equipment was impacted by regional technological breakthroughs, industrialization, and economic expansion. This market includes items' packaging and assembly machinery from many industries.

Key Findings of the Study

• The global packaging and assembly equipment market is expected to reach USD 35.517 billion by 2032, at a CAGR of 14.50% during the forecast period.


• The Asia-Pacific region accounted for the fastest-growing global market. The market for packaging and assembly equipment is trying to grow in China, South Korea, and India in order to seize the new growth prospects brought about by the growing popularity of tablets and wearable technologies.


• Based on type, the plating equipment segment was attributed to holding the largest market in 2022, with an approximate market share of 40%.


• Amkor Technology, Tokyo Electron Limited, Lam, Research Corporation, ASML Holding N.V, Applied Materials, KLA-Tencor, Hitachi High-Technologies Corporation, Advantest, Screen Holdings Co. Ltd., and Teradyne Inc.