FinFET Technology Market is Expected to Attain an Outstanding Valuation Near Future

Pune, India, July 2019, MRFR Press Release/- Market Research Future has Published a Cooked Research Report on the Global FinFET Technology Market.

Overview

The Global FinFET Technology Market is expected to reach USD 268.66 Million by 2025 at a CAGR of 40.03% during the forecast period. Market Research Future (MRFR) in its report envelops segmentations and drivers to provide a better glimpse of the market in the coming years. Over the last decade, there have been rapid developments in the FinFET Technology. Fin Field Effect Transistor or FinFET is a technology non-planar 3D transistor that is based on dual gate structure. It is widely used to develop products such as SoC, FGPA, and processors as it offers various benefits such as small size, high performance, and lower energy consumption in the end products.

Competitive Analysis

The key players of global FinFET technology market are Taiwan Semiconductor Manufacturing Co. Ltd (Taiwan), Intel Corporation (US), Samsung Electronics Corporation Ltd (South Korea), GLOBALFOUNDRIES (US), Xilinx, Inc. (US), Qualcomm Technologies Inc. (US), ARM Limited (UK), MediaTek, Incorporated (Taiwan), Semiconductor Manufacturing International Corp. (China), Atomera, Inc. (US), Huawei Technologies Co. Ltd (China), Apple Inc. (US), Broadcom Inc. (US), NVIDIA Corporation (US), United Microelectronics Corporation (Taiwan), and Advanced Micro Devices (AMD) Inc. (US), among others.

Browse Full Report Details @ https://www.marketresearchfuture.com/reports/finfet-technology-market-6724

Segmental Analysis

The global FinFET technology market has been segmented based on technology, application, end user, and region.

Based on technology, the market has been classified as 3nm, 5nm, 7nm, 10nm, 14nm, 16nm, 20nm, and 22nm. The 10nm segment was valued at USD 8,831.1; it is expected to register a steady CAGR during the forecast period. The 16nm technology increases transistor performance as well as helps in improving memory and power management. As compared to 28nm technology, 22nm provides 10% area reduction and more than 30% power reduction for applications including image processing, set-top boxes, digital TVs, smartphones, and other consumer products.

Based on application, the market has been segmented into Central Processing Unit(CPU), System-on-Chip(SoC), Field-Programmable Gate Array(FPGA), Graphics Processing Unit(GPU), and Network Processor. The SoC segment accounted for the larger market share in 2018. The network processor segment was the second-largest market in 2018. The CPU segment is expected to register the higher CAGR during the forecast period. FinFETs are commonly recognized as one of the promising devices to replace planar devices because of their excellent electrostatic and short channel control. The FPGA comprises programmable logic blocks and interconnection circuits that are widely used in electronic circuits. GPUs require optimum power efficiency in terms of deep learning, object recognition, artificial intelligence, simulations, and virtual reality/augmented reality (VR/AR) for improved performance.

Based on end-user, the market has been segmented into mobile, cloud server/high-end networks, IoT/consumer electronics, automotive, and others. The IoT/consumer electronics segment accounted for the larger market share in 2018; it is expected to register the higher CAGR during the forecast period. The mobile segment was the second-largest market in 2018. A cloud server is a virtual server that runs on the cloud computing environment and is built, hosted, and delivered through cloud computing platform via the Internet and can be accessed remotely. Stringent safety requirements for the automotive industry are encouraging chipmakers to adopt FinFET technology to re-examine a number of factors that can impact reliability over the lifespan of a device.

Recent Developments

• In May 2019, Realme launched Realme C3, powered by 2GHz octa-core MediaTek Helio P22. This is built with highly efficient 12nm FinFET fabrication process using MediaTek's CorePilot technology.

• In November 2018, Xilinx, Inc. further expanded its defense-grade XQ UltraScale+product portfolio. The expansion offers ruggedized packages and resistance to extreme temperatures of the aerospace & defense industry. The products included in the portfolio are XQ Zynq UltraScale+ MPSoCs, RFSoCs, XQ UltraScale+ Kintex, and Virtex FPGAs. The products are based on 16 nm FinFET technology provided by Taiwan Semiconductor Manufacturing Company (TSMC).