Encapsulation Resins Market is predicted to reach USD 5.67 Billion at a CAGR of 3.40% during the forecast period:

Pune, India, August 2023, MRFR Press Release/- Market Research Future has Published a Half-Cooked Research Report on the Global Encapsulation Resins Market.

Market Research Future (MRFR) has published a cooked research report on the “Encapsulation Resins Market” that contains information from 2018 to 2032. The Encapsulation Resins Market is estimated to register a CAGR of 3.40% during the forecast period of 2023 to 2032.

MRFR recognizes the following companies as the key players in the global Encapsulation Resins Market — Aremco (US), Dow (US), Hitachi Chemical Co., Henkel AG & Co. KGaA (Germany), BASF SE (Germany), H.B. Fuller Company (US), Huntsman International LLC (US), Master Bond Inc. (US), ELANTAS GmbH (Germany), Shin-Etsu Chemical Co., MG Chemicals (US), Dymax Corporation (US), Robnor ResinLab Ltd (UK), LORD Corporation (US) and RBC Industries

Encapsulation Resins Market Highlights

The global Encapsulation Resins Market is accounted to register a CAGR of 3.40% during the forecast period and is estimated to reach USD 5.67 Billion by 2032.

the encapsulation resins market refers to the industry that deals with the production, distribution, and use of encapsulation resins. These resins are specialized compounds used to protect and insulate electronic components and devices from environmental factors such as moisture, dust, chemicals, and mechanical stress. The encapsulation process involves covering the electronic components with a protective resin to prevent damage and enhance their durability and reliability.

Segment Analysis

The global Encapsulation Resins Market has been segmented based on Product Type, Application, and End-Use Industry.

The encapsulation resins market segmentation, based on product type includes epoxy resins, silicone resins, polyurethane resins and others. The epoxy resins segment dominated the market. Due to their characteristics, including low shrinkage after curing, toughness, exceptional chemical resistance, and hardness, epoxy resins have been widely used in a variety of applications during the past many years. These resins provide greater protection against corrosive chemicals and humidity, have a low coefficient of thermal expansion, and are simple to apply.

The encapsulation resins market segmentation, based on application, includes transformers, sensors, switchgears, insulators, capacitors, relays & coils, adhesives & sealants and others. The sensors category generated the most income. Encapsulation resins are frequently used to safeguard and improve the functioning of different kinds of sensors. Resin materials are frequently used to encapsulate temperature sensors, such as thermocouples and resistance temperature detectors (RTDs). Temperature sensors are given mechanical stability, thermal insulation, and environmental protection by encapsulation resins, enabling precise and trustworthy temperature measurements in a variety of applications.

The encapsulation resins market segmentation, based on end-use industry, includes building & construction, automotive, transportation, electrical & electronics, marine and others. The electrical & electronics category generated the most income. The encapsulating and potting of a variety of electrical and electronic applications frequently uses silicone, epoxy, and polyurethane resins. Electrical devices and components can be protected using these resins from hostile environmental elements. Additionally, it safeguards electronic components against a number of security risks like tampering. Electric components like integrated circuits (ICs), capacitors, and diodes can all benefit from encapsulation, which can be employed on the entire assembly.

Regional Analysis

The global Encapsulation Resins Market, based on region, has been divided into North America, Europe, Asia-Pacific and Rest of the World. The North American encapsulation resins market area will dominate this market due to regional growth in the marine and construction industries, as well as regional growth in the market for electronic equipment. The prominent presence of electrical and electronics companies in this region and the industry's impressive expansion throughout the years in this region are fueling the market's expansion. Further, the major countries studied in the market report are The US, Canada, German, France, the UK, Italy, Spain, China, Japan, India, Australia, South Korea, and Brazil.

Europe encapsulation resins market accounts for the second-largest market share because the region's automobile industry is experiencing moderate expansion. The need for encapsulating resins is also being driven by the increased use of these materials in a variety of electronics devices as well as their use in the building and construction, automotive, and aerospace industries. Further, the German encapsulation resins market held the largest market share, and the UK encapsulation resins market was the fastest growing market in the European region

The Asia-Pacific Encapsulation resins Market is expected to grow at the fastest CAGR from 2023 to 2032. This expansion is primarily related to the rise in demand for encapsulating resins in a variety of electronic applications, including transformers, cables, printed circuit boards, photonics integrated circuits, sensor assemblies, and many more. Moreover, China’s encapsulation resins market held the largest market share, and the Indian encapsulation resins market was the fastest growing market in the Asia-Pacific region.

Key Findings of the Study

• The global Encapsulation Resins Market is expected to reach USD 5.67 Billion by 2032, at a CAGR of 3.40% during the forecast period.


• The Asia-Pacific Encapsulation resins Market is expected to grow at the fastest CAGR from 2023 to 2032. This expansion is primarily related to the rise in demand for encapsulating resins in a variety of electronic applications, including transformers, cables, printed circuit boards, photonics integrated circuits, sensor assemblies, and many more.


• The encapsulation resins market segmentation, based on product type includes epoxy resins, silicone resins, polyurethane resins and others. The epoxy resins segment dominated the market.


• Aremco (US), Dow (US), Hitachi Chemical Co., Henkel AG & Co. KGaA (Germany), BASF SE (Germany), H.B. Fuller Company (US), Huntsman International LLC (US), Master Bond Inc. (US), ELANTAS GmbH (Germany), Shin-Etsu Chemical Co., MG Chemicals (US), Dymax Corporation (US), Robnor ResinLab Ltd (UK), LORD Corporation (US), and RBC Industries.

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